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公开(公告)号：US09711992B2
公开(公告)日：2017-07-18
申请号：US14180501
申请日：2014-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Myoung-hoon Jung , Jung-woo Kim , Young-Jun Yun
CPC classification number: H02J50/05 , G06F1/1637 , G06F1/1643 , G06F1/26 , G06F1/263 , G06F3/0412 , G09G3/3648 , G09G3/3655 , G09G2330/00 , H01H36/00 , H02J7/0047 , H02J7/025 , H02J17/00 , H02J50/12 , Y10T307/391 , Y10T307/826
Abstract: A display device includes a display panel including at least one electrode, and a panel driving unit configured to drive the display panel. The display device further includes a power storage unit configured to store received power, and a switching unit configured to electrically connect the at least one electrode to one of the panel driving unit and the power storage unit.
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公开(公告)号：US10354967B2
公开(公告)日：2019-07-16
申请号：US15456882
申请日：2017-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-woo Kim , Woon-bae Kim , Bo-in Noh , Go-woon Seong , Ji-yong Park
Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
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公开(公告)号：US10134667B2
公开(公告)日：2018-11-20
申请号：US15964342
申请日：2018-04-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-woo Kim , Jae-min Jung , Ji-yong Park , Jeong-kyu Ha , Woon-bae Kim
IPC: H01L33/48 , H01L23/498 , H01L23/29 , H01L23/00 , H01L23/488 , H01L33/62 , H01L23/492 , H01L25/16
Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
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公开(公告)号：US20180247882A1
公开(公告)日：2018-08-30
申请号：US15964342
申请日：2018-04-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-woo Kim , Jae-min Jung , Ji-yong Park , Jeong-kyu Ha , Woon-bae Kim
IPC: H01L23/498 , H01L23/29 , H01L23/00 , H01L33/62 , H01L23/488 , H01L33/48
CPC classification number: H01L23/4985 , H01L23/29 , H01L23/488 , H01L23/4922 , H01L24/29 , H01L24/32 , H01L25/167 , H01L33/48 , H01L33/62 , H01L2924/143 , H01L2924/186
Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
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公开(公告)号：US20150168528A1
公开(公告)日：2015-06-18
申请号：US14555538
申请日：2014-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Shin-ho Kang , Joon-su Ji , Jung-woo Kim
CPC classification number: G01R35/00 , G01R31/2889
Abstract: Provided is a probe card inspection apparatus including: a substrate; a first insulating layer which covers the substrate; and a first detection unit which is formed on the first insulating layer and detects physical defects of a probe of a probe card. The first detection unit includes: a ground detection unit including a first conductive pattern which defines a plurality of openings which expose a portion of the first insulating layer and detect defects of a ground probe of the probe card and; and a signal and power detection unit including a second conductive pattern which defines a plurality of openings which expose another portion of the first insulating layer and detect defects of a signal and power supply probe of the probe card.
Abstract translation: 提供一种探针卡检查装置，包括：基板; 覆盖基板的第一绝缘层; 以及第一检测单元，其形成在所述第一绝缘层上并且检测所述探针卡的探针的物理缺陷。 第一检测单元包括：接地检测单元，包括限定多个开口的第一导电图案，第一导电图案暴露第一绝缘层的一部分并检测探针卡的接地探针的缺陷; 以及信号和功率检测单元，其包括限定多个开口的第二导电图案，所述多个开口暴露所述第一绝缘层的另一部分并且检测所述探针卡的信号和电源探针的缺陷。
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Patent Agency Ranking
公开(公告)号：US09993221B2
公开(公告)日：2018-06-12
申请号：US14945916
申请日：2015-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung-hoon Kim , Sang-woo Kim , Jung-woo Kim , Sung-jin Park , Ja-woong Yoon , Eun-aeh Cho , Jin-beom Hong , Do-hyeong Hwang
CPC classification number: A61B6/547 , A61B6/06 , A61B6/4405
Abstract: An X-ray apparatus includes an X-ray radiator configured to radiate an X-ray, and a controller acquiring orientation information of the X-ray radiator and orientation information of at least one X-ray detector, selecting the at least one X-ray detector based on the orientation information of the X-ray radiator and the orientation information of the at least one X-ray detector, and determining a power mode of the selected X-ray detector to be a power consumption mode and a power mode of an X-ray detector that is not selected, to be a power save mode.
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7.发明申请公开(公告)号：US20180012069A1
公开(公告)日：2018-01-11
申请号：US15638660
申请日：2017-06-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dae-young Chung , Hee-chang Hwang , Kun-yong Yoon , Woon-bae Kim , Bum-suk Kim , Min Jang , Min-chul Lee , Jung-woo Kim
IPC: G06K9/00
CPC classification number: G06K9/00563 , A61B5/1172 , G06K9/00013 , G06K9/0004 , G06K9/00046 , G06K9/00053 , G06K9/00087 , G06K9/0012 , G06K9/2036 , G06K9/24
Abstract: At least some example embodiments provide a fingerprint sensor, a fingerprint sensor package, and a fingerprint sensing system using light sources of a display panel. The fingerprint sensor includes an image sensor including a plurality of sensor pixels, the sensor pixels configured to sense light reflected by a fingerprint and generate image information corresponding to the fingerprint and a pinhole mask defining a plurality of pinholes, wherein each of the pinholes forms a focus for transmitting the light reflected by the fingerprint to the image sensor, wherein light is emitted from a plurality of organic light-emitting diodes (OLEDs) and is reflected by the fingerprint.
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公开(公告)号：US10379658B2
公开(公告)日：2019-08-13
申请号：US14196430
申请日：2014-03-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-woo Kim , Young-jun Yun , Myoung-hoon Jung
IPC: G06F3/041 , G06F1/3234 , G06F3/045
Abstract: The touch sensing apparatus includes a driving unit and a touch sensing unit, a scan region selecting unit, and a control unit. The driving unit and the touch sensing unit arranged at a touch panel are electrically connected to driving electrodes and sensing electrodes, respectively. The scan region selecting unit controls the driving unit and determines a narrowed scan region including a touched location by dividing a touch region of the touch panel into a plurality of scan regions, scanning each of the scan regions, and selecting a scan region including the touched location at least for once. The control unit controls the scan region selecting unit and the driving unit and determines the narrowed scan region including the touched location and sense the touched location by inputting signals in a time-division manner to a plurality of scan lines included in the narrowed scan region.
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公开(公告)号：US09978674B2
公开(公告)日：2018-05-22
申请号：US15479856
申请日：2017-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-woo Kim , Jae-min Jung , Ji-yong Park , Jeong-kyu Ha , Woon-bae Kim
IPC: H01L33/48 , H01L23/498 , H01L23/00 , H01L23/29 , H01L23/488 , H01L33/62
CPC classification number: H01L23/4985 , H01L23/29 , H01L23/488 , H01L23/4922 , H01L24/29 , H01L24/32 , H01L25/167 , H01L33/48 , H01L33/62 , H01L2924/143 , H01L2924/186
Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
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公开(公告)号：US09696402B2
公开(公告)日：2017-07-04
申请号：US14555538
申请日：2014-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Shin-ho Kang , Joon-su Ji , Jung-woo Kim
CPC classification number: G01R35/00 , G01R31/2889
Abstract: Provided is a probe card inspection apparatus including: a substrate; a first insulating layer which covers the substrate; and a first detection unit which is formed on the first insulating layer and detects physical defects of a probe of a probe card. The first detection unit includes: a ground detection unit including a first conductive pattern which defines a plurality of openings which expose a portion of the first insulating layer and detect defects of a ground probe of the probe card and; and a signal and power detection unit including a second conductive pattern which defines a plurality of openings which expose another portion of the first insulating layer and detect defects of a signal and power supply probe of the probe card.
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