Patent search ap:("Samsung Electronics Co. Page Ltd.") AND inv:"Jun-Kyum Kim"

1.

发明申请
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES 审中-公开
Title translation: 制造具有接触片的半导体器件的方法重叠相关的位线结构和接触孔

公开(公告)号：US20170025419A1

公开(公告)日：2017-01-26

申请号：US15288228

申请日：2016-10-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Kyum Kim , JUNG-WOO SEO , SUNG-UN KWON

IPC: H01L27/108 , H01L21/768

CPC classification number: H01L27/10885 , H01L21/76879 , H01L27/10814 , H01L27/10817 , H01L27/10823 , H01L27/10855 , H01L27/10876 , H01L27/10891

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

Abstract translation: 半导体器件可以包括根据衬底上的布局布置的多个着陆焊盘，其中每个着陆焊盘的横截面形状具有菱形形状，使得菱形形状的相对内部角度彼此相等，并且钻石形状的相邻内角彼此不相等。

2.

发明授权
Semiconductor devices 有权

公开(公告)号：US10700074B2

公开(公告)日：2020-06-30

申请号：US16782213

申请日：2020-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon

IPC: H01L23/52 , H01L27/108 , H01L21/768

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

3.

发明授权
Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes 有权

公开(公告)号：US10446558B2

公开(公告)日：2019-10-15

申请号：US16234223

申请日：2018-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon

IPC: H01L29/00 , H01L27/108 , H01L21/768

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

4.

发明授权
Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes 有权

公开(公告)号：US10573653B2

公开(公告)日：2020-02-25

申请号：US16553840

申请日：2019-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon

IPC: H01L23/52 , H01L27/108 , H01L21/768

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

5.

发明授权
Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes 有权

公开(公告)号：US09786672B2

公开(公告)日：2017-10-10

申请号：US15288228

申请日：2016-10-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon

IPC: H01L21/336 , H01L27/108 , H01L21/768

CPC classification number: H01L27/10885 , H01L21/76879 , H01L27/10814 , H01L27/10817 , H01L27/10823 , H01L27/10855 , H01L27/10876 , H01L27/10891

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

6.

发明申请
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES 审中-公开

公开(公告)号：US20190131307A1

公开(公告)日：2019-05-02

申请号：US16234223

申请日：2018-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon

IPC: H01L27/108 , H01L21/768

CPC classification number: H01L27/10885 , H01L21/76879 , H01L27/10814 , H01L27/10817 , H01L27/10823 , H01L27/10855 , H01L27/10876 , H01L27/10891

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

7.

发明授权
Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes 有权

公开(公告)号：US10177155B2

公开(公告)日：2019-01-08

申请号：US15716230

申请日：2017-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon

IPC: H01L29/00 , H01L27/108 , H01L21/768

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

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