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公开(公告)号:US10720470B2
公开(公告)日:2020-07-21
申请号:US16277385
申请日:2019-02-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byongju Kim , Young-min Ko , Jong-uk Kim , Kwangmin Park , Jeong-hee Park
Abstract: There is provided a variable resistance memory device including a first electrode line layer including first electrode lines extending in a first direction and spaced apart from each other on a substrate, a second electrode line layer that is above the first electrode line layer and including second electrode lines extending in a second direction orthogonal to the first direction and spaced apart from each other, and a memory cell layer including memory cells between the first electrode line layer and the second electrode line layer. Each of the memory cells includes a selection device layer, an intermediate electrode layer, and a variable resistance layer. A first insulating layer is between the first electrode lines, a second insulating layer is between the memory cells, and a third insulating layer is between the second electrode lines. The second insulating layer includes air gaps on side surfaces of the memory cells.
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公开(公告)号:US20200052038A1
公开(公告)日:2020-02-13
申请号:US16277385
申请日:2019-02-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byongju Kim , Young-min Ko , Jong-uk Kim , Kwangmin Park , Jeong-hee Park
Abstract: There is provided a variable resistance memory device including a first electrode line layer including first electrode lines extending in a first direction and spaced apart from each other on a substrate, a second electrode line layer that is above the first electrode line layer and including second electrode lines extending in a second direction orthogonal to the first direction and spaced apart from each other, and a memory cell layer including memory cells between the first electrode line layer and the second electrode line layer. Each of the memory cells includes a selection device layer, an intermediate electrode layer, and a variable resistance layer. A first insulating layer is between the first electrode lines, a second insulating layer is between the memory cells, and a third insulating layer is between the second electrode lines. The second insulating layer includes air gaps on side surfaces of the memory cells.
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