公开(公告)号：US20240395753A1

公开(公告)日：2024-11-28

申请号：US18584876

申请日：2024-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bong geun Choi ,  Jisuk Kwon ,  Seokjae Lee

IPC: H01L23/00 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor memory device includes a memory cell array, first to fourth I/O pads under the memory cell array and configured to connect with an external device, and first to fourth I/O driving modules between the memory cell array and the first to fourth I/O pads and configured to drive the first to fourth I/O pads, respectively. In a plan view, the first and second I/O driving modules are disposed symmetrically with respect to a first line extending in a first direction, the third and fourth I/O driving modules are disposed symmetrically with respect to the first line, the first and third I/O driving modules are disposed symmetrically with respect to a second line extending in a second direction crossing the first direction, and the second and fourth I/O driving modules are disposed symmetrically with respect to the second line.