METHOD FOR ESTIMATING LOCATION OF OBJECT, AND APPARATUS THEREFOR

    公开(公告)号:US20210188320A1

    公开(公告)日:2021-06-24

    申请号:US17057538

    申请日:2019-05-20

    Abstract: The disclosure relates to a method of estimating a location of an object and an apparatus therefor. According to an embodiment of the disclosure, an object location estimation apparatus, when a call request to an object is received from a terminal, initiates driving along a driving path, receives signals from the object during driving along the driving path, determines a distance to the object based on the signals from the object, and when the signals from the object are received the preset number of times or more during driving, estimates the location of the object based on the distance to the object determined based on each of the signals and a location on the driving path at a time of receiving each signal.

    SEMICONDUCTOR MEASUREMENT APPARATUS
    3.
    发明公开

    公开(公告)号:US20230186460A1

    公开(公告)日:2023-06-15

    申请号:US18060830

    申请日:2022-12-01

    CPC classification number: G06T7/001 H04N23/56 H04N23/10 H01L27/108

    Abstract: A semiconductor measurement device may include an illumination apparatus having a polarizer on a propagation path of light output from a light source; an optical assembly including an objective lens configured to allow light passing through the polarizer to be incident on a sample and a beam splitter configured to transmit light reflected from the sample to first and second sensors; and a controller. The controller may be configured to determine an alignment state of patterns in a first region of the sample using a first original image output by the first sensor and an alignment state of patterns in a second region of the sample using a second original image output by the second sensor. The first sensor includes a first image sensor and a self-interference generator in a path along which light is incident on the first image sensor. The second sensor includes a second image sensor.

    IMAGE MEASUREMENT DEVICE AND METHOD THEREOF

    公开(公告)号:US20250045870A1

    公开(公告)日:2025-02-06

    申请号:US18766740

    申请日:2024-07-09

    Abstract: An image measurement device includes an optical system that transmits light output to an image detection unit, the image detection unit configured to detect the light and generate an image, and an image processing unit that extracts spectral data from the image, wherein the image processing unit generates a profile according to an amount of light for each of a plurality of pixels based on the image, and performs Fourier transform on the profile.

    SEMICONDUCTOR MEASUREMENT APPARATUS
    7.
    发明公开

    公开(公告)号:US20240230314A9

    公开(公告)日:2024-07-11

    申请号:US18317395

    申请日:2023-05-15

    CPC classification number: G01B9/02044 G01B9/02097 G01B2210/56 G01B2290/70

    Abstract: A semiconductor measurement apparatus may include an illumination unit configured to irradiate light to the sample, an image sensor configured to receive light reflected from the sample and output multiple interference images representing interference patterns of polarization components of light, an optical unit in a path through which the image sensor receives light and including an objective lens above the sample, and a control unit configured to obtain, by processing the multi-interference image, measurement parameters determined from the polarization components at each of a plurality of azimuth angles defined on a plane perpendicular to a path of light incident to the image sensor. The control unit may be configured to determine a selected critical dimension to be measured from a structure in the sample based on measurement parameters. The illumination unit and/or the optical unit may include a polarizer and a compensator having a ¼ wave plate.

    SEMICONDUCTOR MEASUREMENT APPARATUS
    8.
    发明公开

    公开(公告)号:US20240133673A1

    公开(公告)日:2024-04-25

    申请号:US18317395

    申请日:2023-05-14

    CPC classification number: G01B9/02044 G01B9/02097 G01B2210/56 G01B2290/70

    Abstract: A semiconductor measurement apparatus may include an illumination unit configured to irradiate light to the sample, an image sensor configured to receive light reflected from the sample and output multiple interference images representing interference patterns of polarization components of light, an optical unit in a path through which the image sensor receives light and including an objective lens above the sample, and a control unit configured to obtain, by processing the multi-interference image, measurement parameters determined from the polarization components at each of a plurality of azimuth angles defined on a plane perpendicular to a path of light incident to the image sensor. The control unit may be configured to determine a selected critical dimension to be measured from a structure in the sample based on measurement parameters. The illumination unit and/or the optical unit may include a polarizer and a compensator having a ¼ wave plate.

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