公开(公告)号：US20250167068A1

公开(公告)日：2025-05-22

申请号：US18927154

申请日：2024-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinkyu YANG ,  Eunhye LEE ,  Doyoung JUNG ,  Hyunik HWANG

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H10B80/00

Abstract: A memory module may include a module substrate having a first surface and a second surface opposite to the first surface, the module substrate extending in a first direction; a plurality of electronic devices mounted on the first surface of the module substrate; a heat sink thermally coupled with the first surface of the module substrate, the heat sink including a base plate on the plurality of electronic devices and a plurality of heat dissipating fins on the base plate to be spaced apart from each other along the first direction, each of the plurality of heat dissipating fins extending in a second direction different from the first direction; and a plurality of adsorption work-pads respectively on a plurality of a central heat dissipating fins among the plurality of heat dissipating fins on a central region of the base plate, each of the plurality of adsorption work-pads having a hinge portion secured to an upper surface of the central heat dissipating fins and a folding portion extending from the hinge portion in the first direction and foldable by a certain angle relative to the hinge portion.