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    X-ray imaging apparatus and control method for the same
    1.
    发明授权
    X-ray imaging apparatus and control method for the same 有权

    公开(公告)号：US10542945B2

    公开(公告)日：2020-01-28

    申请号：US15202012

    申请日：2016-07-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyung-Won Yoon ,  Su Young Ko ,  Tae Kyun Kim ,  Jin-Ho Choi ,  Hyung Sok Yeo ,  Jun Young Lee

    IPC: A61B6/00 ,  A61B6/04 ,  A61B6/02

    Abstract: An X-ray imaging method and an apparatus having an improved structure configured to reduce pain and discomfort during a procedure. The X-ray imaging apparatus acquires an X-ray image by compressing an object that is irradiated by an X-ray source. An X-ray detector includes an object contact material that contacts the object. X-rays that pass through the object are detected X-rays, an electrical signal is generated based on the X-rays. A paddle is disposed between the X-ray source and the X-ray detector to be vertically adjustable relative to the X-ray source and X-ray detector so as to compress the object placed on the object contact surface. The paddle includes a supporting member, a pressure member coupled to the supporting member, and at least one adjustment member arranged between the supporting member and the pressure member to regulate movement of the pressure member according to the shape of the object.

    X-ray detector and X-ray imaging apparatus having the same
    2.
    发明授权
    X-ray detector and X-ray imaging apparatus having the same 有权

    公开(公告)号：US10531847B2

    公开(公告)日：2020-01-14

    申请号：US15653165

    申请日：2017-07-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyoung Choul Jang ,  Dae Soo Kim ,  Seong Hwa Park ,  Jin-Ho Choi

    IPC: A61B6/00

    Abstract: Disclosed is an X-ray detector having impact resistance and an X-ray imaging apparatus having the X-ray detector. The X-ray imaging apparatus comprises an X-ray source for generating and irradiating X-rays and an X-ray detector for detecting the X-rays irradiated from the X-ray source. The X-ray detector comprises a main body having a bottom plate including a joining groove, a detector panel arranged inside the main body for converting X-rays irradiated from the X-ray source into electric signals, and a middle block arranged inside the main body to support the detector panel. The middle block has a boss configured to protrude toward the bottom plate of the main body. The boss is inserted into the joining groove. A buffer member is arranged in at least part of the joining groove to prevent the boss from coming into contact with the joining groove.

    X-RAY DETECTOR AND X-RAY IMAGING APPARATUS HAVING THE SAME
    4.
    发明申请
    X-RAY DETECTOR AND X-RAY IMAGING APPARATUS HAVING THE SAME 审中-公开

    公开(公告)号：US20180014800A1

    公开(公告)日：2018-01-18

    申请号：US15653165

    申请日：2017-07-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyoung Choul Jang ,  Dae Soo Kim ,  Seong Hwa Park ,  Jin-Ho Choi

    IPC: A61B6/00

    CPC classification number: A61B6/44 ,  A61B6/4405 ,  A61B6/4441 ,  A61B6/484 ,  A61B6/566

    Abstract: Disclosed is an X-ray detector having impact resistance and an X-ray imaging apparatus having the X-ray detector. The X-ray imaging apparatus comprises an X-ray source for generating and irradiating X-rays and an X-ray detector for detecting the X-rays irradiated from the X-ray source. The X-ray detector comprises a main body having a bottom plate including a joining groove, a detector panel arranged inside the main body for converting X-rays irradiated from the X-ray source into electric signals, and a middle block arranged inside the main body to support the detector panel. The middle block has a boss configured to protrude toward the bottom plate of the main body. The boss is inserted into the joining groove. A buffer member is arranged in at least part of the joining groove to prevent the boss from coming into contact with the joining groove.

    Apparatus for testing semiconductor device
    6.
    发明授权
    Apparatus for testing semiconductor device 有权

    公开(公告)号：US11519953B2

    公开(公告)日：2022-12-06

    申请号：US16875065

    申请日：2020-05-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Min Woo Kim ,  Seung Bin Ko ,  Dong Joo Roh ,  Chang Ho Lee ,  Jin-Ho Choi

    IPC: G01R31/26 ,  G01R31/28 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073

    Abstract: An apparatus for testing a semiconductor device is described. The apparatus includes a test chamber in which a test process for a plurality of semiconductor devices is performed, a first storage disposed in the test chamber with a first semiconductor device located therein, a second storage spaced apart in a first direction from the first storage with a second semiconductor device located therein, a first nozzle extending in the first direction on a first sides of the first and second storages and including a plurality of first air outlets configured to discharge air, a second nozzle extending in the first direction on and including a plurality of second air outlets configured to discharge air, and a controller controlling temperatures of the first and second semiconductor devices within a predefined temperature range by controlling the air discharged by the first and second nozzles.

    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME
    7.
    发明申请
    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME 有权

    公开(公告)号：US20210003632A1

    公开(公告)日：2021-01-07

    申请号：US17031390

    申请日：2020-09-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Woo Kim ,  Chang-Ho Lee ,  Jin-Ho Choi

    IPC: G01R31/28

    Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.

    Semiconductor chip including a plurality of pads
    10.
    发明授权
    Semiconductor chip including a plurality of pads 有权

    公开(公告)号：US10756059B2

    公开(公告)日：2020-08-25

    申请号：US16157642

    申请日：2018-10-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kwanyeob Chae ,  Sanghoon Joo ,  Jong-Ryun Choi ,  Jin-Ho Choi

    IPC: H01L25/065 ,  H01L23/50 ,  H01L23/58 ,  H01L23/60 ,  H01L23/00 ,  H01L23/528 ,  H01L23/522

    Abstract: A semiconductor chip including a plurality of input/output units includes: a plurality of additional pads disposed on a surface of the semiconductor chip, wherein the plurality of additional pads include at least one of a first additional pad to which a ground voltage is applied and a second additional pad to which a power supply voltage is applied; and a plurality of pads disposed on the surface of the semiconductor chip, wherein the plurality of pads include at least one of a first pad to which the ground voltage is applied and a second pad to which the power supply voltage is applied, and further include a third pad through which a signal is input and/or output. The at least one of the first additional pad and the second additional pad is disposed on an input/output unit where the third pad is disposed, among the plurality of input/output units.

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