NETWORK NODE AND METHOD PERFORMED BY NETWORK NODE

    公开(公告)号:US20230362730A1

    公开(公告)日:2023-11-09

    申请号:US18185043

    申请日:2023-03-16

    CPC classification number: H04W28/0942 H04W72/535 H04W74/0816

    Abstract: A network node and a method performed by the network node are provided. According to an embodiment, a method performed by a network node is provided. The method comprises obtaining prediction information on an availability of an unlicensed band based on historical data of the unlicensed band. The method comprises selecting transmission resources of the unlicensed band based on the prediction information. The method comprises determining a number of data packets capable of being allocated to the transmission resources based on the prediction information. The method comprises transmitting the data packets on the transmission resources according to the determined number of data packets capable of being allocated to the transmission resources.

    METHOD PERFORMED BY NETWORK NODE IN COMMUNICATION SYSTEM AND NETWORK NODE

    公开(公告)号:US20250133543A1

    公开(公告)日:2025-04-24

    申请号:US18931837

    申请日:2024-10-30

    Abstract: The disclosure relates to a method performed by a network node in a communication system and the network node, which relates to a field of artificial intelligence. The method comprises: determining a first resource allocation pattern corresponding to at least one cell; obtaining a second resource allocation pattern corresponding to the at least one cell, by adjusting the first resource allocation pattern of the at least one cell based on information related to interference between cells. The method may be performed by an electronic apparatus and may be performed using an artificial intelligence model.

    INTEGRATED CIRCUITS WITH INTERNAL PADS
    4.
    发明申请
    INTEGRATED CIRCUITS WITH INTERNAL PADS 有权
    内部集成电路

    公开(公告)号:US20150145122A1

    公开(公告)日:2015-05-28

    申请号:US14267872

    申请日:2014-05-01

    Abstract: An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate.

    Abstract translation: 一个实施例包括集成电路,包括:衬底; 形成在所述衬底上并耦合到所述衬底上的多个第一焊盘的第一电路; 以及形成在所述衬底上并耦合到所述衬底上的多个第二焊盘的第二电路。 第一焊盘形成在衬底的周边上; 并且第二焊盘从衬底的周边延伸到衬底的内部。

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