System on chip including secure processor and semiconductor system including the same

    公开(公告)号:US12135829B2

    公开(公告)日:2024-11-05

    申请号:US17585881

    申请日:2022-01-27

    Abstract: A secure processor and a semiconductor system including the same is provided. Provided is a system on chip comprising a secure processor, wherein the secure processor includes: a random access memory (RAM) including a RAM cache area storing a page and a timestamp table storing a timestamp, an encryption/decryption engine configured to encrypt the page by using the timestamp, and a direct memory access (DMA) module configured to transmit the encrypted page to a swap area of a first memory disposed outside the system on chip, wherein the first memory includes a tag table area storing a tag generated by the encryption/decryption engine encrypting the page and a timestamp backup area backing up the timestamp, and the swap area, the tag table area, and the time stamp backup area are backed up in a second memory disposed outside the system on chip.

    Semiconductor devices and methods of operating the same

    公开(公告)号:US10951215B2

    公开(公告)日:2021-03-16

    申请号:US16722362

    申请日:2019-12-20

    Abstract: A semiconductor device includes a time-to-digital converter (TDC) that receives a reference frequency signal and a feedback frequency signal, and outputs a first digital signal indicating a time difference between the reference frequency signal and the feedback frequency signal; a digital loop filter (DLF) that outputs a second digital signal generated by filtering the first digital signal; a multiplier circuit that outputs one of a third digital signal and a final test signal, the third digital signal generated by performing a multiplication operation on the second digital signal using a multiplication coefficient; a digital-controlled oscillator (DCO) that generates an oscillation signal having a frequency based on the output one of the third digital signal and the final test signal; and a loop gain calibrator (LGC) that receives the oscillation signal, generates a pair of test signals, and determines the multiplication coefficient using the pair of test signals.

    Electronic device including speaker

    公开(公告)号:US10356500B2

    公开(公告)日:2019-07-16

    申请号:US16046502

    申请日:2018-07-26

    Inventor: Ji Hyun Kim

    Abstract: An electronic device is disclosed. The electronic device includes a housing, a display, at least one through-hole, a speaker module, and an internal structure. The housing includes a front plate, a rear plate, and a side member. The display and the speaker module are disposed between the front plate and the rear plate. The through-hole is formed through the front plate between a portion of the side member and the display. The speaker module includes an acoustic generation surface facing the front plate near the through-hole. The internal structure is disposed between the front plate and the acoustic generation surface. The internal structure and the acoustic generation surface form a space, acoustically connected to the through-hole. The internal structure includes a surface facing the acoustic generation surface. The surface of the internal structure includes a plurality of areas, each with a different clearance from the acoustic generation surface.

    ELECTRONIC DEVICE INCLUDING SPEAKER
    9.
    发明申请

    公开(公告)号:US20190037293A1

    公开(公告)日:2019-01-31

    申请号:US16046502

    申请日:2018-07-26

    Inventor: Ji Hyun Kim

    Abstract: An electronic device is disclosed. The electronic device includes a housing, a display, at least one through-hole, a speaker module, and an internal structure. The housing includes a front plate, a rear plate, and a side member. The display and the speaker module are disposed between the front plate and the rear plate. The through-hole is formed through the front plate between a portion of the side member and the display. The speaker module includes an acoustic generation surface facing the front plate near the through-hole. The internal structure is disposed between the front plate and the acoustic generation surface. The internal structure and the acoustic generation surface form a space, acoustically connected to the through-hole. The internal structure includes a surface facing the acoustic generation surface. The surface of the internal structure includes a plurality of areas, each with a different clearance from the acoustic generation surface.

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