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公开(公告)号:US20250081585A1
公开(公告)日:2025-03-06
申请号:US18952625
申请日:2024-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaejin LEE , Youngjun KIM , Hunyoung BARK , Taekyung YOON , Eunok LEE
Abstract: A gate structure includes a first gate electrode including a metal, a gate barrier pattern on the first gate electrode and including a metal nitride, and a second gate electrode on the gate barrier pattern. The gate structure is buried in an upper portion of a substrate. The gate barrier pattern has a flat upper surface and an uneven lower surface.
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公开(公告)号:US20230290681A1
公开(公告)日:2023-09-14
申请号:US17957473
申请日:2022-09-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taekyung YOON , Youngjun KIM , Hunyoung BARK , Eun-Ok LEE , Jaejin LEE , Dongju CHANG
IPC: H01L21/768 , H01L21/67 , H01L21/3213
CPC classification number: H01L21/76877 , H01L21/76829 , H01L21/67103 , H01L21/3213 , H01L21/76856
Abstract: Provided is a method of fabricating a semiconductor device including forming a device isolation layer defining active regions on a substrate and forming gate lines intersecting the active regions and buried in the substrate. The forming of the gate lines includes forming a trench crossing the active regions in the substrate, forming a conductive layer filling the trench, and performing a heat treatment process on the conductive layer. The conductive layer includes a nitride of a first metal. Nitrogen atoms in the conductive layer are diffused toward an outer surface and a lower surface of the conductive layer by the heat treatment process.
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公开(公告)号:US20230168856A1
公开(公告)日:2023-06-01
申请号:US17957491
申请日:2022-09-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Wookwang LEE , Jaejin LEE
Abstract: According to various embodiments, there may be provided an electronic device comprising a vibration device, a vibration device integrated circuit (IC) connected to the vibration device, a first bus, a second bus, and at least one processor electrically connected to the vibration device IC through each of the first bus and the second bus; wherein the at least one processor is configured to transfer first data to the vibration device IC through the first bus, transfer second data to the vibration device IC through the second bus different from the first bus, and control the vibration device IC to drive the vibration device based on data selected from the first data and the second data. Other various embodiments are possible as well.
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公开(公告)号:US20210397481A1
公开(公告)日:2021-12-23
申请号:US17145958
申请日:2021-01-11
Inventor: Wookeun JUNG , Jaejin LEE , Seung Wook LEE
Abstract: A processor-implemented accelerator method includes: reading, from a memory, an instruction to be executed in an accelerator; reading, from the memory, input data based on the instruction; and performing, on the input data and a parameter value included in the instruction, an inference task corresponding to the instruction.
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公开(公告)号:US20210310287A1
公开(公告)日:2021-10-07
申请号:US17221090
申请日:2021-04-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jongwoo HAN , Youngkyu MOON , Jaejin LEE , Sungwook KANG , Joongkyung PARK
Abstract: Provided is a refrigerator including a main body configured to form a storage chamber, a door configured to open and close the storage chamber, a hinge configured to rotatably support the door, and a height adjusting device configured to be coupled to the hinge and located inside the door, wherein the height adjusting device includes a lever provided to be operable from an outside of the door, a power transmission member provided to be movable as the lever rotates, and a support member configured to guide the power transmission member in a first direction as the lever rotates to move the power transmission member so that a height of the door is increased, and guide the power transmission member in a second direction, different from the first direction, as the lever rotates to move the power transmission member so that the height of the door is decreased.
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6.
公开(公告)号:US20180276178A1
公开(公告)日:2018-09-27
申请号:US15926932
申请日:2018-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wookwang LEE , Byungjun KIM , Dongrak SHIN , Jaejin LEE
Abstract: In an electronic device and a method for operating the electronic device according to various embodiments, the electronic device may comprise a housing, a USB Type-C connector configured to be connected to the housing or exposed through the housing and to include at least one configuration channel (CC) pin, a circuit configured to be disposed in the housing and connected electrically to the connector, and a processor configured to be disposed in the housing and connected electrically to the circuit. The circuit may be configured to transmit and receive a packet through the CC pin. The packet may sequentially comprise a message header, a first vendor defined message (VDM) header, and a second VDM header including a product identifier and a data type. Further, various other embodiments can be implemented according to the present disclosure.
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公开(公告)号:US20240019812A1
公开(公告)日:2024-01-18
申请号:US18360379
申请日:2023-07-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyunghwan LEE , Kwangsoo HAN , Sangrok OH , Yonglim LEE , Jaejin LEE , Wookdam JUNG
CPC classification number: G04B19/283 , G04G21/00 , G04G99/006
Abstract: An example wearable electronic device may include a main body including a first surface having an opening area formed therein, wherein a plurality of lateral walls, surrounding at least one part of the opening area, are formed in the peripheral area of the opening area; a display disposed inside the main body and which is viewable through the opening area; a wheel including a mounted part, which is at least partially mounted on the peripheral area, and an extension part which extends in the inward direction from the mounted part, wherein the wheel is formed in a ring shape extending in the circumferential direction with respect to a rotation axis of the wheel; and a guide member partially coming into contact with the main body and the wheel, respectively, and for guiding the rotation of the wheel. The guide member may include a first part having at least one portion thereof extending to a space between the plurality of lateral walls and a second part at least partially inserted to a first recess formed in each of the plurality of lateral walls.
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公开(公告)号:US20220268510A1
公开(公告)日:2022-08-25
申请号:US17744330
申请日:2022-05-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chanbin PARK , Yang-Yeol GU , Jaejin LEE , Jeonghyun LEE
Abstract: A refrigerator with an enhanced door includes a main body including a storeroom, first and second doors pivotally coupled to the main body to open or close the storeroom and a pivot bar pivotally installed at the first door. The pivot bar is movable between a first position between the first and second doors and a second position pivoted toward the first door to prevent cold air leaks from the storeroom. A locking device separably locks the pivot bar to the first door when the pivot bar is in the second position.
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公开(公告)号:US20220084939A1
公开(公告)日:2022-03-17
申请号:US17223144
申请日:2021-04-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaejin LEE , Hana KIM , Jaewha PARK , Dongchan LIM
IPC: H01L23/522 , H01L23/528 , H01L23/532 , H01L21/768
Abstract: A wiring structure includes a filling metal, a cover metal including cobalt (Co) on the filling metal, the cover metal having a first portion along a side surface and along a lower surface of the filling metal, and a second portion along an upper surface of the filling metal, a barrier metal on an outer surface of the first portion of the cover metal, and a capping metal on an outer surface of the second portion of the cover metal, the capping metal including a cobalt (Co) alloy, wherein the filling metal has higher conductivity than the cover metal and the barrier metal.
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10.
公开(公告)号:US20200329580A1
公开(公告)日:2020-10-15
申请号:US16844671
申请日:2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gyoungsoo YEO , Jeonggyu PARK , Jaejin LEE , Seongu KANG
Abstract: The disclosure relates to a communication technique and system after 4G systems for combining a 5G communication system with IoT technology to support higher data rates. Based on 5G communication and IoT-related technologies, the disclosure can be applied to intelligent services (e.g., smart home, smart building, smart city, smart or connected car, healthcare, digital education, retail, security, and safety).A converter may include: a first printed circuit board having a first controller for power conversion disposed on an inner surface of the first printed circuit board, the inner surface of the first printed circuit board comprised in an inner surface of the converter; a second printed circuit board having a second controller for power conversion disposed on an inner surface of the second printed circuit board, the inner surface of the second printed circuit board facing the inner surface of the first printed circuit board and comprised in the inner surface of the converter; first connectors disposed on the inner surface of the first printed circuit board; and second connectors disposed on the inner surface of the second printed circuit board, the second connectors configured to be coupled with the first connectors.
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