Method of manufacturing semiconductor device

    公开(公告)号:US09852256B2

    公开(公告)日:2017-12-26

    申请号:US14450337

    申请日:2014-08-04

    CPC classification number: G06F17/5077 H01L21/76898

    Abstract: A method for manufacturing a semiconductor device can reduce congestion across wires while reducing a wire length. The method includes determining a first TSV candidate region in a first die and determining a second TSV candidate region in a second die parallel to the first die. The method also includes determining a first bound region. The first bound region includes a horizontal location of a first pin of the first die and a horizontal location of a second pin of the second die. The method additionally includes calculating an area from overlapped regions between the first bound region and each of the first TSV candidate region and the second TSV candidate region, and performing routing for connecting the first pin and the second pin to each other based on the calculated area.

    Method of designing power supply network
    4.
    发明授权
    Method of designing power supply network 有权
    电源网络设计方法

    公开(公告)号:US09135390B2

    公开(公告)日:2015-09-15

    申请号:US14308741

    申请日:2014-06-19

    CPC classification number: G06F17/5077 G06F17/5081 G06F2217/78 H05K3/0005

    Abstract: To design a power supply network of a 3D semiconductor device employing through-silicon-via (TSV) technology, board wiring of each of boards of the device is determined. An initial network structure is created for the boards. A layout of power bumps and through-silicon-vias, using the initial network structure, is produced such that voltages of all nodes of wiring of the boards are greater than a reference voltage. A semiconductor device having boards, power bumps and through-silicon-vias conforming to the layout is fabricated. Thus, the numbers of the through-silicon-vias and the power bumps of the power supply network of the semiconductor device are minimal.

    Abstract translation: 为了设计采用硅通孔(TSV)技术的3D半导体器件的电源网络,确定了器件的每个板的板布线。 为电路板创建初始网络结构。 产生使用初始网络结构的功率凸起和穿通硅通孔的布局,使得电路板的所有节点的电压都大于参考电压。 制造具有符合布局的板,功率凸起和穿硅通孔的半导体器件。 因此,半导体器件的电源网络的贯通硅通孔和电源突起的数量是最小的。

    Wireless power receiver and method for controlling same

    公开(公告)号:US10236722B2

    公开(公告)日:2019-03-19

    申请号:US15338947

    申请日:2016-10-31

    Abstract: An electronic device and a method of operating the electronic device are provided. The electronic device includes a communication circuit; a battery; a first conductive pattern electrically connected to the battery and configured to wirelessly receive power; a second conductive pattern electrically connected to the communication circuit; a processor; and a memory that stores instructions, which when executed, instruct the processor to receive power from an external device through the first conductive pattern, to detect a voltage or a current of a signal output from the second conductive pattern while receiving the power, and to provide an output that is at least partially based on the detected voltage or current of the signal output from the second conductive pattern.

    Method and system for providing virtual messenger service

    公开(公告)号:USRE47137E1

    公开(公告)日:2018-11-20

    申请号:US14878726

    申请日:2015-10-08

    Abstract: Provided are a method and a system for providing a virtual messenger service between a mobile communication terminal and a computer. The method includes executing a virtual messenger program for controlling a function of a mobile communication terminal, and receiving a telephone directory provided within the mobile communication terminal; displaying a messenger window when receiving a request for activating the messenger window that collectively includes the telephone directory and menus; generating a communication event message related with a selected telephone number of the other party; and transmitting the generated event message to the mobile communication terminal, and displaying a notification of a communication event to an other party.

    IP based automatic response service system and method for electronic device
    7.
    发明授权
    IP based automatic response service system and method for electronic device 有权
    基于IP的电子设备自动响应服务系统和方法

    公开(公告)号:US09398153B2

    公开(公告)日:2016-07-19

    申请号:US13921524

    申请日:2013-06-19

    CPC classification number: H04M3/5191 H04M3/5166 H04M2203/253

    Abstract: An electronic device using an Internet Protocol (IP) telephony technology and a method and system for forwarding information between the electronic device and a call center system are provided. The method includes sending, by an electronic device, a telephony connection request to a call center system, generating, by a switch device, a response message including connection information of a web ARS server of the call center system in response to the telephony connection request, sending, by the switch device, the response message including the connection information to the electronic device, forming, by the electronic device, a data session with the web ARS server using the received connection information of the web ARS server, and providing the ARS of the display scheme using information received from the web ARS server.

    Abstract translation: 提供了一种使用因特网协议(IP)电话技术的电子设备以及用于在电子设备和呼叫中心系统之间转发信息的方法和系统。 该方法包括由电子设备向电话中心系统发送电话连接请求,由交换设备通过响应电话连接请求生成包括呼叫中心系统的网络ARS服务器的连接信息的响应消息 ,由所述交换设备向所述电子设备发送包括所述连接信息的响应消息,由所述电子设备使用所述接收到的所述Web ARS服务器的连接信息与所述web ARS服务器进行数据会话,并且提供所述ARS 的显示方案使用从ARS服务器接收的信息。

Patent Agency Ranking