公开(公告)号：US20240120276A1

公开(公告)日：2024-04-11

申请号：US18227113

申请日：2023-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Seung CHOI ,  Byung-Su KIM ,  Bong Il PARK ,  Chang Seok KWAK ,  Sun Hee PARK ,  Sang Joon CHEON

IPC: H01L23/528 ,  H01L23/498 ,  H01L23/522 ,  H01L27/06

CPC classification number: H01L23/5283 ,  H01L23/49816 ,  H01L23/5226 ,  H01L27/0688

Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.

公开(公告)号：US20160066413A1

公开(公告)日：2016-03-03

申请号：US14843137

申请日：2015-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Hyun KIM ,  Joon Gyu LEE ,  Sang Yong EOM ,  Jae Seung CHOI

IPC: H05K1/02 ,  H05K13/00 ,  H05K5/00

CPC classification number: G06F1/1626 ,  G06F1/1601 ,  G06F1/1652 ,  G06F1/1656 ,  G06F3/04886 ,  G06F2200/1612 ,  G06F2203/04102 ,  H04M1/0268 ,  Y10T428/10 ,  Y10T428/1036

Abstract: A display apparatus comprising: a flexible display panel including a display view area and a dummy area around the display view area, wherein the flexible display panel are bended at least on the display view area; a polarizing plate disposed over the display view area of the flexible display panel and between the flexible display panel and a protective panel; the protective panel disposed over the polarizing plate; and a step coverage base disposed over the dummy area of the flexible display panel, alongside to the polarizing plate.

Abstract translation: 一种显示装置，包括：柔性显示面板，包括显示视野区域和显示视野区域周围的虚拟区域，其中柔性显示面板至少在显示视野区域弯曲; 设置在柔性显示面板的显示视野区域之间以及柔性显示面板与保护面板之间的偏振片; 设置在偏振板上的保护面板; 以及设置在柔性显示面板的虚拟区域上方的台阶覆盖基板，与偏振板一起。

公开(公告)号：US20170251093A1

公开(公告)日：2017-08-31

申请号：US15593034

申请日：2017-05-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Si Hyun PARK ,  Talipov ELMUROD ,  Dal Young YU ,  Hoon KIM ,  Young Woon KIM ,  Jae Seok LEE ,  Jae Seung CHOI

IPC: H04M1/725 ,  H04L12/28

CPC classification number: H04M1/72533 ,  H04L12/282 ,  H04L12/2834 ,  H04L63/0492 ,  H04L63/08 ,  H04L63/18 ,  H04L2012/2841 ,  H04L2012/285 ,  H04M1/7253 ,  H04W4/80 ,  H04W4/90 ,  H04W12/003

Abstract: A control method of a home appliance, the method including retrieving information about a communication device, authenticating the communication device, registering the authenticated communication device, receiving voice data from the registered communication device, outputting a voice signal corresponding to the received voice data to a user, receiving the voice signal from the user, and transmitting voice data corresponding to the received voice signal to the communication device. When the method is used, even if a user loses a communication device in a home, call is possible using a home appliance such as refrigerator.

公开(公告)号：US20240203944A1

公开(公告)日：2024-06-20

申请号：US18370650

申请日：2023-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Seung CHOI ,  Byung-Su Kim

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541

Abstract: A semiconductor device includes a first die including a plurality of first micro bumps on a first upper face of the first die, a plurality of first macro metal pads at positions respectively corresponding to the plurality of first micro bumps, a first routing wiring layer comprising a plurality of first routing metals, where a first end of each of the plurality of first routing metals is respectively under the plurality of first macro metal pads, a plurality of through silicon vias (TSVs), where first ends of the plurality of TSVs are respectively connected to second ends of the plurality of first routing metals, and where each of the plurality of TSVs extends downward from the respective second ends of the plurality of first routing metals, a first plurality of keep-out zones including a first keep-out zone bundle region, and a plurality of first micro metal pads.