公开(公告)号：US10849502B2

公开(公告)日：2020-12-01

申请号：US14618290

申请日：2015-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung-hun Choi ,  Do-yoon Kim ,  In-young Lee ,  Jae-geol Cho

IPC: A61B5/00 ,  G06F19/00

Abstract: A peripheral device for providing a health information message to a host device includes a health data obtainer configured to obtain health data; a message generator configured to determine a type of the health data, a private message identification (ID) corresponding to the type of the health data, and an ID of the peripheral device, and generate the health information message to include the private message ID, the ID of the peripheral device, and the health data; and a message provider configured to transmit the health information message to the host device, the private message ID being configured to be interpreted differently according to the ID of the peripheral device.

公开(公告)号：US09412707B2

公开(公告)日：2016-08-09

申请号：US14702662

申请日：2015-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-soo Chung ,  Tae-je Cho ,  Jung-seok Ahn ,  In-young Lee

IPC: H01L29/40 ,  H01L23/00 ,  H01L23/48 ,  H01L21/78 ,  H01L21/304 ,  H01L21/683 ,  H01L25/00 ,  H01L25/065 ,  H01L21/768 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/304 ,  H01L21/4803 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Embodiments of the inventive aspect include a method of manufacturing a semiconductor package including a plurality of stacked semiconductor chips in which edges of a semiconductor wafer substrate may be prevented from being damaged or cracked when the semiconductor package is manufactured at a wafer level, while a diameter of a molding element is greater than a diameter of the semiconductor wafer substrate. The molding element may cover a surface of the wafer substrate and the plurality of stacked semiconductor chips. Embodiments may include a wafer level semiconductor package including a circular substrate having a first diameter, a circular passivation layer attached to the circular substrate, the passivation layer having the first diameter, and a circular molding element covering surfaces of the plurality of semiconductor chips, and covering an active area of the substrate. The circular molding element may have a second diameter that is greater than the first diameter.

Abstract translation: 本发明的实施例包括一种制造半导体封装的方法，该半导体封装包括多个层叠半导体芯片，其中半导体封装在晶片级制造时可以防止半导体晶片衬底的边缘损坏或破裂，而直径 的模制元件的直径大于半导体晶片衬底的直径。 成型元件可以覆盖晶片基板的表面和多个堆叠的半导体芯片。 实施例可以包括晶片级半导体封装，其包括具有第一直径的圆形衬底，附着到圆形衬底的圆形钝化层，具有第一直径的钝化层和覆盖多个半导体芯片的表面的圆形模制元件，以及 覆盖基板的有效区域。 圆形模制元件可以具有大于第一直径的第二直径。

公开(公告)号：US09912065B2

公开(公告)日：2018-03-06

申请号：US13928524

申请日：2013-06-27

Applicant: Samsung Electronics Co., Ltd

Inventor： Tae-young Kim ,  Chee-hwan Yang ,  In-young Lee ,  Sang-hoon Choi

IPC: H01Q9/28 ,  H01Q9/26 ,  H01Q5/371 ,  H01Q1/22 ,  H01Q1/48

CPC classification number: H01Q9/285 ,  H01Q1/2266 ,  H01Q1/48 ,  H01Q5/371 ,  H01Q9/26

Abstract: A dipole antenna module and an electronic apparatus include an antenna element, a power feeder formed at an end of the antenna element and connected to a circuit board to process an antenna signal through a cable, and a ground part to ground a ground of the cable such that the ground part keeps a preset gap from the antenna element and is grounded to a conductor of the circuit board.

公开(公告)号：US20170117264A1

公开(公告)日：2017-04-27

申请号：US15285500

申请日：2016-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-young Lee ,  Hyun-soo Chung ,  Tae-je Cho

IPC: H01L25/00 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/568 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/18162

Abstract: A method may include providing a first semiconductor chip and a first insulating layer surrounding lateral sides of the first semiconductor chip; providing a second semiconductor chip and a second insulating layer surrounding lateral sides of the second semiconductor chip; providing a third insulating layer below the first semiconductor chip and first insulating layer, so that the first semiconductor chip is between the third insulating layer and the second semiconductor chip, the third insulating layer forming a package substrate; providing a plurality of external connection terminals on the third insulating layer, such that the third insulating layer has a first surface facing the first semiconductor chip and a second surface facing the external connection terminals; providing a first redistribution line on the first surface of the third insulating layer and extending horizontally along the first surface of the third insulating layer, the first redistribution line contacting a first conductive pad of the first semiconductor chip; and providing a second redistribution line connected to a second conductive pad at a surface of the second semiconductor chip, the second redistribution line passing through the first insulating layer to contact the first redistribution line.

公开(公告)号：US09899723B2

公开(公告)日：2018-02-20

申请号：US14518064

申请日：2014-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-young Lee ,  Hwan-myung Noh ,  Byung-gil Jeon

IPC: H01Q1/22 ,  H01Q7/00 ,  G06F1/16 ,  G06K7/10

CPC classification number: H01Q1/2266 ,  G06F1/1698 ,  G06K7/10336 ,  H01Q7/00

Abstract: An electronic device with an antenna, e.g., for near field communication (NFC) is disclosed. The electronic device includes a display, a fixing frame fixing the display and including a bezel area at a periphery of the display, and a communication module disposed at the bezel area. The communication module includes a circuit board, which has an antenna radiator and a communication circuit disposed thereon. The communication module performs wireless communication with an external apparatus via the communication circuit and antenna radiator.