Abstract:
A housing forms the appearance of an electronic device. A method of manufacturing the housing includes selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility, determining quantity and stacking sequence of the selected fiber substrates, and laminating and attaching the fiber substrates according to the determined quantity and stacking sequence.
Abstract:
A housing forms the appearance of an electronic device. A method of manufacturing the housing includes selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility, determining quantity and stacking sequence of the selected fiber substrates, and laminating and attaching the fiber substrates according to the determined quantity and stacking sequence.
Abstract:
An electronic device is provided including a plurality of electronic parts; one or more housing components forming a space for receiving the plurality of electronic parts; and a cover detachable from the one or more housing components, the cover including a first member having a plurality of metal elements suspended in a non-metal base and a second member coupled to the first member.