公开(公告)号：US20210320067A1

公开(公告)日：2021-10-14

申请号：US17035000

申请日：2020-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Joo KIM ,  Sun Chul KIM ,  Min Keun KWAK ,  Hyun Ki KIM ,  Hyung Gil BAEK ,  Yong Kwan LEE

IPC: H01L23/538 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

公开(公告)号：US20220392845A1

公开(公告)日：2022-12-08

申请号：US17891190

申请日：2022-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Joo KIM ,  Sun Chul KIM ,  Min Keun KWAK ,  Hyun Ki KIM ,  Hyung Gil BAEK ,  Yong Kwan LEE

IPC: H01L23/538 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.