公开(公告)号：US20220392845A1

公开(公告)日：2022-12-08

申请号：US17891190

申请日：2022-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Joo KIM ,  Sun Chul KIM ,  Min Keun KWAK ,  Hyun Ki KIM ,  Hyung Gil BAEK ,  Yong Kwan LEE

IPC: H01L23/538 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

公开(公告)号：US20210320067A1

公开(公告)日：2021-10-14

申请号：US17035000

申请日：2020-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Joo KIM ,  Sun Chul KIM ,  Min Keun KWAK ,  Hyun Ki KIM ,  Hyung Gil BAEK ,  Yong Kwan LEE

IPC: H01L23/538 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

公开(公告)号：US20150160675A1

公开(公告)日：2015-06-11

申请号：US14621962

申请日：2015-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun Ki KIM ,  Jae Min LIM ,  Seong Uk PYUNG ,  Sun Il JIN ,  Hyeng Kyun KIM ,  Jae Yu SEO ,  Seong Wook JEONG ,  Sung Ho CHO ,  Jung Won PARK ,  Jang Beom YANG ,  Chang Ho SON ,  Young Jin BAEK

IPC: G05F1/66 ,  G05B15/02 ,  H04L12/28 ,  F24F11/00

CPC classification number: G05F1/66 ,  F24F11/30 ,  F24F11/58 ,  F24F11/62 ,  G05B15/02 ,  H02J3/00 ,  H04L12/2803

Abstract: A demand response (DR) system includes a DR control unit to generate different DR levels having different power rates for each power unit, and transmit a current DR level, and a household appliance to receive the DR level from the DR control unit, and differentially control energy output of a product in response to the received DR level so as to reduce power consumption of the product. As a result, the DR system reduces power consumption when power rates are high so as to reduce electricity bills.

Abstract translation: 需求响应（DR）系统包括：DR控制单元，用于为每个功率单元生成具有不同功率率的不同DR电平，并且传送当前的DR电平;以及家用电器，用于从DR控制单元接收DR电平; 响应于接收到的DR级别来控制产品的能量输出，以便降低产品的功耗。 因此，DR系统降低电力利用率时的功耗，从而降低电费。