公开(公告)号：US20230361150A1

公开(公告)日：2023-11-09

申请号：US18130014

申请日：2023-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeyeon Park ,  Boseong Kim ,  Yunki Lee

IPC: H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14607

Abstract: A manufacturing method of an image sensor includes, operations of: forming a color filter layer over a plurality of pixel regions having a plurality of photodetectors and arranged in a matrix on a substrate, and patterning the color filter layer with a mask including patterns disposed adjacently in a diagonal direction of the matrix, to form color filters for some of the plurality of pixel regions on the substrate. Each of the patterns may include a rectangular main pattern and sub-patterns outwardly extending from corners of the main patterns. Sizes of sub-patterns of different adjacent patterns that face each other may have sizes that are smaller than other sub-patterns of the adjacent patterns.