公开(公告)号：US20250146133A1

公开(公告)日：2025-05-08

申请号：US18672023

申请日：2024-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeontae Kim ,  Yihwan Kim ,  Minsu Lee ,  Hyeonjin Jeon ,  Hyeongun Jeon

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/46 ,  H01L21/687

Abstract: A substrate support unit includes a chuck having an upper surface on which to mount a substrate, and including a heater for heating the substrate; a shaft assembly supporting a lower portion of the chuck, and including an electric line connected to the heater; a support assembly having an accommodation space surrounding and accommodating a portion of the shaft assembly, and supporting the shaft assembly; a seal sealing a lower portion of the accommodation space; an inlet communicating with the accommodation space and configured to transfer cooling gas for cooling the electric line into the accommodation space, the inlet being disposed in one of the support assembly and the seal; and an outlet disposed in the support assembly, communicating with the accommodation space, and configured to transfer the cooling gas out of the support assembly.