公开(公告)号：US20220336578A1

公开(公告)日：2022-10-20

申请号：US17857383

申请日：2022-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gihee CHO ,  Sangyeol KANG ,  Jungoo KANG ,  Taekyun KIM ,  Jiwoon PARK ,  Sanghyuck AHN ,  Jin-Su LEE ,  Hyun-Suk LEE ,  Hongsik CHAE

IPC: H01L49/02 ,  H01L27/108

Abstract: A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.

公开(公告)号：US20220037461A1

公开(公告)日：2022-02-03

申请号：US17189700

申请日：2021-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gihee CHO ,  Sangyeol KANG ,  Jungoo KANG ,  Taekyun KIM ,  Jiwoon PARK ,  Sanghyuck AHN ,  Jin-Su LEE ,  Hyun-Suk LEE ,  Hongsik CHAE

IPC: H01L49/02 ,  H01L27/108

Abstract: A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.

公开(公告)号：US20230337412A1

公开(公告)日：2023-10-19

申请号：US17968464

申请日：2022-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihoon AN ,  Jin-Su LEE ,  Hongsik CHAE ,  Donguk HAN

IPC: H01L27/108

CPC classification number: H01L27/10814 ,  H01L27/10852

Abstract: A semiconductor device includes a substrate, a capacitor contact structure electrically connected to the substrate, and a lower electrode connected to the capacitor contact structure. The lower electrode includes a first electrode layer and a second electrode layer, the second electrode layer is on the first electrode layer, and the first electrode layer includes a group 14 element. The device includes a capacitor insulating layer covering the lower electrode, and an upper electrode covering the capacitor insulating layer. The first electrode layer includes an outer sidewall in contact with the capacitor insulating layer, the first electrode layer includes an inner sidewall in contact with the second electrode layer, and a concentration of the group 14 element in the inner sidewall of the first electrode layer is higher than a concentration of the group 14 element in the outer sidewall of the first electrode layer.

公开(公告)号：US20240021664A1

公开(公告)日：2024-01-18

申请号：US18221495

申请日：2023-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junrak CHOI ,  Yaejin HONG ,  Jinsu LEE ,  Hongsik CHAE

IPC: H10B12/00

CPC classification number: H01L28/75 ,  H10B12/485 ,  H10B12/482 ,  H10B12/315 ,  H01L28/90

Abstract: A semiconductor device includes a substrate, lower electrodes on the substrate, a dielectric layer covering the lower electrodes, and an upper electrode covering the dielectric layer. Each of the lower electrodes includes a first electrode layer having a cylindrical shape, a first insertion layer disposed on the first electrode layer and having a cylindrical shape, a second electrode layer disposed on the first insertion layer and extending to cover an upper end of the first electrode layer and an upper end of the first insertion layer. At least one of the first electrode layer and the second electrode layer has a first stress, and the first insertion layer has a second stress, different from the first stress. The first stress is one of tensile stress and compressive stress, and the second stress is the other of the tensile stress and the compressive stress.

公开(公告)号：US20230217647A1

公开(公告)日：2023-07-06

申请号：US17952386

申请日：2022-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongsik CHAE ,  Taekyun Kim ,  Jin-Su Lee ,  Hyo-Sun Min ,  Hyungsuk Jung ,  Jaehyoung Choi ,  Donguk Han

IPC: H01L27/108 ,  H01L49/02

CPC classification number: H01L27/10814 ,  H01L28/90

Abstract: A semiconductor device includes bottom electrodes on a substrate. A supporting pattern is disposed between the bottom electrodes in a plan view. A top electrode covers the bottom electrodes and the supporting pattern. A dielectric layer is disposed between the bottom electrodes and the top electrode and between the supporting pattern and the top electrode. A capping pattern is interposed between the bottom electrodes and the dielectric layer and between the supporting pattern and the dielectric layer. The capping pattern covers at least a portion of a side surface of the supporting pattern and extends to cover a top surface of the supporting pattern and top surfaces of the bottom electrodes.