公开(公告)号：US09865613B2

公开(公告)日：2018-01-09

申请号：US15058273

申请日：2016-03-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-min Lee ,  Ho-jun Seong ,  Jae-ho Ahn

IPC: H01L23/48 ,  H01L27/11578 ,  H01L21/033 ,  H01L27/11524 ,  H01L27/1157 ,  H01L23/552 ,  H01L27/02 ,  H01L21/74

CPC classification number: H01L27/11578 ,  H01L21/0337 ,  H01L21/743 ,  H01L23/552 ,  H01L27/0203 ,  H01L27/11524 ,  H01L27/1157 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/14

Abstract: There is provided a semiconductor device having an arrangement structure in which high-density line patterns having relatively small widths and relatively tight pitches may be formed. The semiconductor device includes a plurality of line patterns that are spaced apart from one another. The plurality of line patterns include a plurality of main lines that have a first gap therebetween and extend in a first direction and a plurality of sublines that are bent from one end of each of the plurality of main lines. The plurality of sublines have therebetween a distance that is greater than the first gap, and may be spaced apart from extension lines that extend from the one end of each of the plurality of main lines corresponding to the plurality of sublines in the first direction.

公开(公告)号：US09899323B2

公开(公告)日：2018-02-20

申请号：US15377723

申请日：2016-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-jun Seong ,  Jae-hwang Sim

IPC: H01L21/28 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/5283 ,  H01L24/09

Abstract: An integrated circuit device includes a first conductive line and a second conductive line that are spaced apart from each other and extend in a first direction to be parallel to each other; and a contact pad including a pad body including a first branch portion from which the first conductive line branches and a second branch portion from which the second conductive line branches and a loop branch portion that is located between the first branch portion and the second branch portion and protrudes from the pad body. Related devices and fabrication methods are also discussed.

公开(公告)号：US20170309568A1

公开(公告)日：2017-10-26

申请号：US15377723

申请日：2016-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-jun Seong ,  Jae-hwang Sim

IPC: H01L23/528 ,  H01L23/00

CPC classification number: H01L23/5283 ,  H01L24/09

Abstract: An integrated circuit device includes a first conductive line and a second conductive line that are spaced apart from each other and extend in a first direction to be parallel to each other; and a contact pad including a pad body including a first branch portion from which the first conductive line branches and a second branch portion from which the second conductive line branches and a loop branch portion that is located between the first branch portion and the second branch portion and protrudes from the pad body. Related devices and fabrication methods are also discussed.