公开(公告)号：US11626438B2

公开(公告)日：2023-04-11

申请号：US17384865

申请日：2021-07-26

申请人： Samsung Electronics Co., Ltd.

发明人： Joo Sung Moon ,  In Gyu Baek ,  Seung Han Yoo ,  Hae Min Lim ,  Min Jung Chung ,  Jin Yong Choi

IPC分类号： H01L27/146 ,  H01L27/142 ,  H04N5/341

摘要： Image sensors are provided. The image sensor may include a substrate including a first surface and a second surface opposite the first surface, a photoelectric conversion layer in the substrate, and a lower capacitor connection pattern on the first surface of the substrate. The second surface of the substrate may be configured to receive incident light. The lower capacitor connection pattern may include a capacitor region and a landing region protruding from the capacitor region. The image sensors may also include a capacitor structure including a first conductive pattern, a dielectric pattern, and a second conductive pattern sequentially stacked on the capacitor region, a first wire on the capacitor structure and connected to the second conductive pattern, and a second wire connected to the landing region. The first conductive pattern may be connected to the lower capacitor connection pattern. A surface of the first wire facing the substrate and a surface of the second wire facing the substrate may be coplanar.

公开(公告)号：US11107850B2

公开(公告)日：2021-08-31

申请号：US16413190

申请日：2019-05-15

申请人： Samsung Electronics Co., Ltd.

发明人： Joo Sung Moon ,  In Gyu Baek ,  Seung Han Yoo ,  Hae Min Lim ,  Min Jung Chung ,  Jin Yong Choi

IPC分类号： H01L27/146 ,  H01L27/142 ,  H04N5/341

摘要： Image sensors are provided. The image sensor may include a substrate including a first surface and a second surface opposite the first surface, a photoelectric conversion layer in the substrate, and a lower capacitor connection pattern on the first surface of the substrate. The second surface of the substrate may be configured to receive incident light. The lower capacitor connection pattern may include a capacitor region and a landing region protruding from the capacitor region. The image sensors may also include a capacitor structure including a first conductive pattern, a dielectric pattern, and a second conductive pattern sequentially stacked on the capacitor region, a first wire on the capacitor structure and connected to the second conductive pattern, and a second wire connected to the landing region. The first conductive pattern may be connected to the lower capacitor connection pattern. A surface of the first wire facing the substrate and a surface of the second wire facing the substrate may be coplanar.