公开(公告)号：US20250167056A1

公开(公告)日：2025-05-22

申请号：US18744964

申请日：2024-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyuhyeong KIM ,  Chaein MOON

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H01L23/498

Abstract: Provided is a semiconductor package including a substrate defining a first recess portion and a plurality of second recess portions, the plurality of second recess portions are arranged on a bottom surface of the first recess portion, a semiconductor chip in the first recess portion of the substrate, solder balls arranged in the plurality of second recess portions of the substrate and electrically connected to the semiconductor chip, and a heat dissipation structure on the substrate and the semiconductor chip, the bottom surface of the first recess portion of the substrate being on a higher level than upper surfaces of the solder balls.

公开(公告)号：US20240096748A1

公开(公告)日：2024-03-21

申请号：US18453026

申请日：2023-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taejun JEON ,  Yongkwan LEE ,  Gyuhyeong KIM ,  Seunghwan KIM ,  Jongwan KIM ,  Junwoo PARK

IPC: H01L23/473 ,  H01L23/00

CPC classification number: H01L23/473 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16052 ,  H01L2224/16175 ,  H01L2224/16225 ,  H01L2224/32221 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/17151 ,  H01L2924/172 ,  H01L2924/177

Abstract: A chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. The protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. A plurality of apertures are formed through the side walls and through which a fluid enters and exits. The protection frame defines an inner space in which the fluid can flow via the plurality of apertures. Heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.

公开(公告)号：US20250046663A1

公开(公告)日：2025-02-06

申请号：US18667258

申请日：2024-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taejun JEON ,  Yongkwan LEE ,  Seunghwan KIM ,  Junwoo PARK ,  Gyuhyeong KIM

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/64

Abstract: A semiconductor package includes a package substrate having a first region, a second region and third region sequentially arranged from a first side portion to a second side portion thereof. The second region has a chip mounting region in a central region. A semiconductor chip is disposed in the chip mounting region and is mounted on a plurality of substrate pads of the package substrate. A pair of first flow control structures is disposed in the first region and is arranged symmetrically on both sides along a center line passing through a center of the chip mounting region. At least one pair of second flow control structures is disposed in the second region of the package substrate and is arranged symmetrically on both sides of the chip mounting region. A molding member is on the package substrate and fills a gap between the semiconductor chip and the package substrate.

公开(公告)号：US20240420972A1

公开(公告)日：2024-12-19

申请号：US18402567

申请日：2024-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taejun JEON ,  Yongkwan LEE ,  Gyuhyeong KIM ,  Seung Hwan KIM ,  Jongwan KIM ,  Junwoo PARK

IPC: H01L21/67 ,  H01L21/56

Abstract: Disclosed are semiconductor molding apparatuses and compression molding methods. The semiconductor molding apparatus comprises an upper mold capable of supporting a substrate, a lower mold that provides a first cavity capable of being filled with a resin, a guide member that provides a second cavity to be filled with the resin and vertically penetrates the lower mold, and a guide lift capable of driving the guide member to vertically move. The lower mold includes a base plate that extends in a horizontal direction and a sidewall member that upwardly extends from the base plate. The guide lift drives the guide member to vertically move such that a top surface of the guide member moves between a top surface of the base plate and a top surface of the sidewall member.