公开(公告)号：US11735491B2

公开(公告)日：2023-08-22

申请号：US17505953

申请日：2021-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunggyun Noh ,  Gun-Hee Bae ,  Sangwoo Pae ,  Jinsoo Bae ,  Deok-Seon Choi ,  Il-Joo Choi

IPC: H01L23/367 ,  H01L23/40 ,  H01L23/22

CPC classification number: H01L23/367 ,  H01L23/22 ,  H01L23/4012 ,  H01L2023/4087

Abstract: A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.