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    Package substrate and semiconductor package including the same
    1.
    发明授权
    Package substrate and semiconductor package including the same 有权

    公开(公告)号：US12176308B2

    公开(公告)日：2024-12-24

    申请号：US18459628

    申请日：2023-09-01

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngkyu Lim ,  Gookmi Song ,  Sunguk Lee

    IPC: H01L23/00

    Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.

    SEMICONDUCTOR PACKAGE
    4.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220165698A1

    公开(公告)日：2022-05-26

    申请号：US17401664

    申请日：2021-08-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dahee Kim ,  Jeongrim Seo ,  Gookmi Song

    IPC: H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48

    Abstract: A semiconductor package includes: a redistribution substrate including a connection via and a redistribution layer electrically connected to each other, and a redistribution pad electrically connected to the redistribution layer by the connection via, a space pattern separating at least some of the redistribution pads from each other, a dummy metal pattern at least partially surrounded by the space pattern, and a degassing opening passing through at least one of the redistribution pad and the dummy metal pattern; a connection bump electrically connected to the redistribution pad; and a semiconductor chip on the redistribution substrate and including a connection pad electrically connected to the redistribution layer, the redistribution pad including a plurality of protrusions protruding from the same plane in directions different from each other and having a corner having a rounded shape, and the dummy metal pattern includes branch patterns each extending in directions different from one another.

    Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same
    5.
    发明授权
    Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same 有权

    公开(公告)号：US11302661B2

    公开(公告)日：2022-04-12

    申请号：US16930517

    申请日：2020-07-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngkyu Lim ,  Gookmi Song ,  Sunguk Lee

    IPC: H01L23/00

    Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.

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