INSPECTION SYSTEM AND INSPECTION METHOD FOR SEMICONDUCTOR DEVICE

    公开(公告)号:US20230333027A1

    公开(公告)日:2023-10-19

    申请号:US18118350

    申请日:2023-03-07

    CPC classification number: G01N21/9501 H01L21/67248 G01N2201/12

    Abstract: An optical failure detection system includes a test chamber having an accommodating space therein, the test chamber including an upper cover having an opening therein; a substrate plate provided in the opening of the upper cover, the substrate plate including: a first surface on which a wafer is disposed; a second surface opposite to the first surface; and an optical window formed in a central region of the substrate plate and through which the wafer is exposed; a temperature control device including a plurality of thermoelectric devices provided around the optical window of the substrate plate, the temperature control device being configured to heat or cool at least one semiconductor device of the wafer; and an optical device provided in the accommodating space of the test chamber, the optical device being configured to radiate light toward the at least one semiconductor device through the optical window.

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