INTEGRATED CIRCUIT INCLUDING BIAS CELLS AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20250151350A1

    公开(公告)日:2025-05-08

    申请号:US18940454

    申请日:2024-11-07

    Abstract: An integrated circuit may include: a plurality of wells extending in parallel with each other in a first direction on a substrate having a first conductivity type, the plurality of wells having a second conductivity type; a plurality of first doped regions disposed on the plurality of wells in a first region and a second region, the first region being separated from the second region in the first direction, the plurality of first doped regions having the first conductivity type; a plurality of second doped regions disposed on the substrate between the plurality of wells in the first region and the second region and having the second conductivity type; and a plurality of third doped regions disposed in a third region of the substrate between the first region and the second region and having the first conductivity type.

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