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公开(公告)号:US20250006606A1
公开(公告)日:2025-01-02
申请号:US18416008
申请日:2024-01-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: HYUNJU LEE , GYUHO KANG , SUNG KEUN PARK , KWANGOK JEONG , JAEMOK JUNG , JU-IL CHOI
IPC: H01L23/498 , H01L23/00
Abstract: A semiconductor package may include: a substrate; a seed layer on a first surface of the substrate; a pad on the seed layer and including a first metal layer and a second metal layer on the first metal layer; an insulating layer on the first surface and including a side surface in contact with the second metal layer; and a semiconductor chip above a second surface of the substrate. An interface between the side surface of the insulating layer and the second metal layer may be nonplanar.
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公开(公告)号:US20230103196A1
公开(公告)日:2023-03-30
申请号:US17740508
申请日:2022-05-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: GYUHO KANG , JONGHO PARK , SEONG-HOON BAE , JEONGGI JIN , JU-IL CHOI , ATSUSHI FUJISAKI
IPC: H01L23/48 , H01L25/10 , H01L23/00 , H01L23/498
Abstract: A semiconductor device includes a first redistribution substrate, a semiconductor chip on a top surface of the first redistribution substrate, a conductive structure on the top surface of the first redistribution substrate and laterally spaced apart from the semiconductor chip, and a molding layer on the first redistribution substrate and covering a sidewall of the semiconductor chip and a sidewall of the conductive structure. The conductive structure includes a first conductive structure having a first sidewall, and a second conductive structure on a top surface of the first conductive structure and having a second sidewall. The first conductive structure has an undercut at a lower portion of the first sidewall. The second conductive structure has a protrusion at a lower portion of the second sidewall.
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公开(公告)号:US20220077043A1
公开(公告)日:2022-03-10
申请号:US17306988
申请日:2021-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: GYUHO KANG , SEONG-HOON BAE , JIN HO AN , TEAHWA JEONG , JU-IL CHOI , ATSUSHI FUJISAKI
IPC: H01L23/498 , H01L25/065 , H01L25/10 , H01L23/00
Abstract: A semiconductor package includes; a redistribution substrate including a redistribution pattern, a semiconductor chip mounted on a top surface of the redistribution substrate, and a connection terminal between the semiconductor chip and the redistribution substrate. The redistribution substrate further includes; a pad structure including a pad interconnection and a pad via, disposed between the redistribution pattern and the connection terminal, wherein the pad structure is electrically connected to the redistribution pattern and a top surface of the pad structure contacts the connection terminal, a shaped insulating pattern disposed on a top surface of the redistribution pattern, and a pad seed pattern disposed on the redistribution pattern and covering the shaped insulating pattern.
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公开(公告)号:US20230042063A1
公开(公告)日:2023-02-09
申请号:US17852054
申请日:2022-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: SEONGHOON BAE , JUIL CHOI , GYUHO KANG , JONGHO PARK , ATSUSHI FUJISAKI
IPC: H01L25/065 , H01L23/538 , H01L23/367 , H01L23/31 , H01L23/00
Abstract: A semiconductor package includes; laterally stacked semiconductor blocks disposed side by side in a first horizontal direction on a redistribution structure, wherein each semiconductor block among the laterally stacked semiconductor blocks includes laterally stacked semiconductor chips, a heat dissipation plate, and a first molding member on the laterally stacked semiconductor chips.
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公开(公告)号:US20220157702A1
公开(公告)日:2022-05-19
申请号:US17381869
申请日:2021-07-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: JU-IL CHOI , GYUHO KANG , SEONG-HOON BAE , JIN HO AN , JEONGGI JIN , ATSUSHI FUJISAKI
IPC: H01L23/498 , H01L25/065 , H01L25/10 , H01L23/538 , H01L23/00
Abstract: A semiconductor package may include a redistribution substrate, a semiconductor chip mounted on a top surface of the redistribution substrate, and a conductive terminal provided on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern including a via portion in contact with the conductive terminal and a wire portion on the via portion and an insulating layer covering top and side surfaces of the under-bump pattern. A central portion of a bottom surface of the via portion may be provided at a level higher than an edge portion of the bottom surface of the via portion.
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公开(公告)号:US20250105116A1
公开(公告)日:2025-03-27
申请号:US18974377
申请日:2024-12-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: JU-IL CHOI , GYUHO KANG , SEONG-HOON BAE , JIN HO AN , JEONGGI JIN , ATSUSHI FUJISAKI
IPC: H01L23/498 , H01L23/00 , H01L23/538 , H01L25/065 , H01L25/10
Abstract: A semiconductor package may include a redistribution substrate, a semiconductor chip mounted on a top surface of the redistribution substrate, and a conductive terminal provided on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern including a via portion in contact with the conductive terminal and a wire portion on the via portion and an insulating layer covering top and side surfaces of the under-bump pattern. A central portion of a bottom surface of the via portion may be provided at a level higher than an edge portion of the bottom surface of the via portion.
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公开(公告)号:US20230010936A1
公开(公告)日:2023-01-12
申请号:US17568355
申请日:2022-01-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: JEONGGI JIN , GYUHO KANG , UNBYOUNG KANG , HEEWON KIM , JUMYONG PARK , HYUNSU HWANG
IPC: H01L23/00 , H01L23/48 , H01L23/532 , H01L23/522
Abstract: A semiconductor chip includes: a semiconductor substrate; a pad insulating layer on the semiconductor substrate; a through electrode which penetrates the semiconductor substrate and the pad insulating layer and includes a conductive plug and a conductive barrier layer surrounding a sidewall of the conductive plug; and a bonding pad which surrounds a sidewall of the through electrode and is spaced apart from the conductive plug with the conductive barrier layer disposed therebetween.
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