公开(公告)号：US20230042063A1

公开(公告)日：2023-02-09

申请号：US17852054

申请日：2022-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEONGHOON BAE ,  JUIL CHOI ,  GYUHO KANG ,  JONGHO PARK ,  ATSUSHI FUJISAKI

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes; laterally stacked semiconductor blocks disposed side by side in a first horizontal direction on a redistribution structure, wherein each semiconductor block among the laterally stacked semiconductor blocks includes laterally stacked semiconductor chips, a heat dissipation plate, and a first molding member on the laterally stacked semiconductor chips.