公开(公告)号：US20250149458A1

公开(公告)日：2025-05-08

申请号：US18738439

申请日：2024-06-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunkyeong Park ,  SANG SUB SONG ,  SEOKBEOM YONG

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/16 ,  H10B80/00

Abstract: A semiconductor package comprises an interconnection structure including a plurality of signal wires and a plurality of ground wires, wherein the plurality of signal wires and the plurality of ground wires are alternately arranged in the first horizontal direction and extend in the second horizontal direction intersecting with the first horizontal direction; and a first semiconductor chip and a second semiconductor chip on the interconnection structure, wherein the interconnection structure includes first regions under the first semiconductor chip and under the second semiconductor chip and a second region between the first regions, and the plurality of signal wires connect the first semiconductor chip and the second semiconductor chip; wherein each of the plurality of signal wires has a first width in the first horizontal direction in the first region and a second width in the first horizontal direction in the second region, and the second width is greater than the first width.

公开(公告)号：US20250118672A1

公开(公告)日：2025-04-10

申请号：US18759447

申请日：2024-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Sub Song ,  Eunkyeong Park ,  Seokbeom Yong

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L23/522 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor packaging structure is provided including first through third routing layers. Each of the first through third routing layers includes a first through a third plurality of signal wires and a first through a third plurality of ground wires arranged alternately in a first horizontal direction. A plurality of vias connect the first to third ground wires to each other. The first to third signal wires and the first to third ground wires extend in a second horizontal direction intersecting the first horizontal direction. Each signal wire among the first to third signal wires is separated from any other signal wires. The first to third pluralities of signal wires overlap each other, and the first to third pluralities of ground wires overlap each other.