公开(公告)号：US10186541B2

公开(公告)日：2019-01-22

申请号：US15224095

申请日：2016-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun-Hyun Kim ,  Kyeongjae Byeon ,  Chungho Song ,  Heegeun Jeong

IPC: H01L27/146

Abstract: A semiconductor device includes a pad disposed on a semiconductor layer, an insulating layer disposed between the semiconductor layer and the pad, a through-via penetrating the semiconductor layer and the insulating layer so as to be connected to the pad, and an isolation layer penetrating the semiconductor layer and surrounding the pad when viewed from a plan view.

公开(公告)号：US20170040358A1

公开(公告)日：2017-02-09

申请号：US15224095

申请日：2016-07-29

Applicant: Samsung Electronics Co. , Ltd.

Inventor： Sun-Hyun KIM ,  Kyeongjae Byeon ,  Chungho Song ,  Heegeun Jeong

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14636 ,  H01L27/14645 ,  H01L27/14689

Abstract: A semiconductor device includes a pad disposed on a semiconductor layer, an insulating layer disposed between the semiconductor layer and the pad, a through-via penetrating the semiconductor layer and the insulating layer so as to be connected to the pad, and an isolation layer penetrating the semiconductor layer and surrounding the pad when viewed from a plan view.

Abstract translation: 半导体器件包括设置在半导体层上的焊盘，设置在半导体层和焊盘之间的绝缘层，穿透半导体层和绝缘层的贯通孔，以连接到焊盘，并且隔离层穿透 半导体层并且从俯视图观察时围绕该衬垫。