-
公开(公告)号：US20240276205A1
公开(公告)日：2024-08-15
申请号：US18628511
申请日：2024-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junhyuk SONG , Seungwon KANG , Youngsung KHO , Chulmin KIM , Chungkeun LEE
IPC: H04W8/20 , H04L43/0882 , H04W8/18
CPC classification number: H04W8/20 , H04L43/0882 , H04W8/183
Abstract: The present disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system to support higher data transmission rates after a 4th generation (4G) communication system such as long term evolution (LTE). According to embodiments, a method performed by a E2 node is provided. The method comprises receiving, from a near-real time (Near-RT) radio access network (RAN) intelligent controller (RIC), a first message for indicating that load status of the Near-RT RIC is overloaded, waiting for signaling on E2 interface until receiving a second message indicating that the load status of the Near-RT RIC is not overloaded, based on the first message, receiving, from the Near-RT RIC, the second message, and performing the signaling on the E2 interface after receiving the second message.
-
公开(公告)号：US20240134742A1
公开(公告)日：2024-04-25
申请号：US18533281
申请日：2023-12-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Boram HWANG , Chulmin KIM , Hyunjoon CHA
CPC classification number: G06F11/1016 , G06F11/076 , G06F11/1068
Abstract: According to various embodiments, an electronic device comprises: at least one processor; and memory operatively connected to the at least one processor, wherein the memory may store instructions which, when executed by the at least one processor, cause the electronic device to: obtain, from a kernel, at least one address for a first memory area accessible through the kernel; store the at least one address in a second memory area accessible through a hypervisor; based on obtaining an address stored in a kernel stack from the kernel, identify whether the obtained address is defective, on the basis of the at least one stored address; and restore the defective address using at least one address stored in the second memory area in response to identifying the defect in the address.
-
公开(公告)号：US20240237003A1
公开(公告)日：2024-07-11
申请号：US18405396
申请日：2024-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhyuk SONG , Seungwon KANG , Youngsung KHO , Chulmin KIM , Chungkeun LEE
CPC classification number: H04W72/23 , H04W88/085
Abstract: A method performed by an E2 node is provided. The method includes transmitting, to a Near-(RT RAN intelligent controller (RIC), an E2 setup request message, and receiving, from the Near-RT RIC, an E2 setup response message for the E2 setup request message. The E2 setup request message includes E2 node component configuration information. A request part of the E2 node component configuration information includes a gNB CU configuration update message or a gNB-DU configuration update message, in case that the E2 node is a gNB-DU. A response part of the E2 node component configuration information includes a gNB-CU configuration update acknowledge message corresponding to the gNB-CU configuration update message or a gNB-DU configuration update acknowledge message corresponding to the gNB-DU configuration update message, in case that the E2 node is the gNB-DU.
-
公开(公告)号：US20240211137A1
公开(公告)日：2024-06-27
申请号：US17761556
申请日：2022-03-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaeseon SIM , Chulmin KIM , Ohoon KWON , Jaewon KIM , Sooyong SUK , Yongtaek LEE
IPC: G06F3/06
CPC classification number: G06F3/0611 , G06F3/0643 , G06F3/067
Abstract: Various embodiments of the disclosure relate to a device and a method for managing a memory in an electronic device. An electronic device may include: first memory configured to store data related to a file, a second memory configured to temporarily store at least part of the data related to the file, and a processor operatively connected to the first memory and the second memory, wherein the processor may be configured to: monitor access to the data related to the file stored in the first memory for a specified time based on performing of an application program, configure a first access pattern for a first group including the at least part of the data related to the file stored in the first memory based on a monitoring result, and load data of the first group related to the file stored in the first memory into the second memory based on the first access pattern, based on the application program requesting access to the data included in the first group.
-
公开(公告)号：US20240232006A9
公开(公告)日：2024-07-11
申请号：US18533281
申请日：2023-12-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Boram HWANG , Chulmin KIM , Hyunjoon CHA
CPC classification number: G06F11/1016 , G06F11/076 , G06F11/1068
Abstract: According to various embodiments, an electronic device comprises: at least one processor; and memory operatively connected to the at least one processor, wherein the memory may store instructions which, when executed by the at least one processor, cause the electronic device to: obtain, from a kernel, at least one address for a first memory area accessible through the kernel; store the at least one address in a second memory area accessible through a hypervisor; based on obtaining an address stored in a kernel stack from the kernel, identify whether the obtained address is defective, on the basis of the at least one stored address; and restore the defective address using at least one address stored in the second memory area in response to identifying the defect in the address.
-
Patent Agency Ranking
公开(公告)号：US20230118797A1
公开(公告)日：2023-04-20
申请号：US18082966
申请日：2022-12-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chulmin KIM , Ohoon Kwon , Hyunjoon Cha , Jaewon Kim , Sooyong Suk , Yongtaek Lee
IPC: G06F3/06
Abstract: An electronic device includes: a plurality of swap devices; a memory storing instructions and data to swap; and a processor configured to execute the instructions to: based on attributes of the data to swap stored in the memory and attributes of at least one swap device of the plurality of swap devices, identify a swap device for swapping the data among the plurality of swap devices, and swap the data using the identified swap device.
-
公开(公告)号：US20190056883A1
公开(公告)日：2019-02-21
申请号：US16075447
申请日：2017-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chulmin KIM , Sunae SEO , Sooyong SUK
IPC: G06F3/06
Abstract: Various embodiments of the present invention relate to an apparatus and a method for managing memory in an electronic device. The electronic device comprises a volatile memory, a non-volatile memory and a processor, wherein the processor is configured to store first data and second data, stored in a first specified area of the volatile memory, in a second specified area of the volatile memory, to check the stored order of the first data and the second data stored in the second specified area, and to move at least one of the first data and the second data from the second specified area of the volatile memory to a third specified area of the non-volatile memory if the states of the first data and the second data satisfy a specified condition on the basis of the order. Other embodiments may be possible.
-
公开(公告)号：US20150228612A1
公开(公告)日：2015-08-13
申请号：US14600324
申请日：2015-01-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongdae HA , Jaeryoung LEE , Chulmin KIM , Yisung HWANG , Teaseog UM , Yongjin JUNG
IPC: H01L23/00 , H01L21/683
CPC classification number: H01L24/75 , H01L21/67144 , H01L21/6838 , H01L2221/68363 , H01L2224/7555 , H01L2224/7565 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.
Abstract translation: 芯片接合装置包括转印单元，将基板装载到转印单元的装载构件，从转印单元卸载基板的卸载构件，支撑提供模具的晶片的晶片保持器和拾取模具中的一个的粘合构件 可以提供从晶片并且通过使用气体将拾取的模具压靠在基板上而将拾取的模具结合到装载在转印单元上的基板。
-
公开(公告)号：US20240064825A1
公开(公告)日：2024-02-22
申请号：US18225390
申请日：2023-07-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhyuk SONG , Youngsung KHO , Chulmin KIM , Soyeun PARK , Chungkeun LEE
IPC: H04W76/10
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data rate after a 4th generation (4G) communication system such as Long Term Evolution (LTE). In embodiments, a method performed by a first base station (e.g., an E2 node) includes transmitting an E2 setup request message to a network controller (e.g., a near-real time (RT) radio access network (RAN) intelligent controller (RIC)). The method includes receiving an E2 setup response message from the network controller. The E2 setup request message includes information for indicating an E2 interface between the E2 node and the near-RT RIC among an NG interface, an XN interface, an E1 interface, a F1 interface, a W1 interface, a S1 interface, a X2 interface, and the E2 interface and information for indicating a version of E2 application protocol (E2AP) of a radio network layer in the E2 interface between the E2 node and the near-RT RIC.
-
10.发明公开公开(公告)号：US20230359355A1
公开(公告)日：2023-11-09
申请号：US18356777
申请日：2023-07-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sooyong SUK , Chulmin KIM , Ohoon KWON , Jaewon KIM , Jaeseon SIM , Yongtaek LEE , Hyunjoon CHA
IPC: G06F3/06
CPC classification number: G06F3/0608 , G06F3/0647 , G06F3/0673
Abstract: An electronic device is provided. The electronic device includes a volatile memory for storing user data, a non-volatile memory, and a processor operatively connected to the volatile memory and the non-volatile memory. The processor may be configured to store first compressed objects, which are obtained by compressing some of the user data in a page unit, in an empty area of the volatile memory, to move a second compressed object, which satisfies a specified condition, from among the first compressed objects to a temporary buffer set in the volatile memory, and to move third compressed objects, which are stored in the temporary buffer, to the non-volatile memory in a compressed state when the temporary buffer is filled to have a specified size or more.
-
-
-
-
-
-
-
-
-
Search Results
14
records
(took 0.018 seconds)
