公开(公告)号：US20150228612A1

公开(公告)日：2015-08-13

申请号：US14600324

申请日：2015-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongdae HA ,  Jaeryoung LEE ,  Chulmin KIM ,  Yisung HWANG ,  Teaseog UM ,  Yongjin JUNG

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L24/75 ,  H01L21/67144 ,  H01L21/6838 ,  H01L2221/68363 ,  H01L2224/7555 ,  H01L2224/7565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.

Abstract translation: 芯片接合装置包括转印单元，将基板装载到转印单元的装载构件，从转印单元卸载基板的卸载构件，支撑提供模具的晶片的晶片保持器和拾取模具中的一个的粘合构件 可以提供从晶片并且通过使用气体将拾取的模具压靠在基板上而将拾取的模具结合到装载在转印单元上的基板。