公开(公告)号：US20190385999A1

公开(公告)日：2019-12-19

申请号：US16274229

申请日：2019-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Matthew BERZINS ,  Andrew Paul HOOVER ,  Christopher Alan PEURA

IPC: H01L27/02 ,  G06F17/50 ,  H01L29/423 ,  H01L23/522 ,  H01L27/118

Abstract: According to one general aspect, an apparatus may include a metal layer having a metal pitch between metal elements, and a gate electrode layer having a gate pitch between gate electrode elements, wherein the gate electrode pitch is a ratio of the metal pitch. The apparatus may include at least two power rails coupled, by via staples, with the metal layer, wherein the via staples at least partially overlap one or more of the gate electrode elements. The apparatus may include even and odd pluralities of standard cells, each respectively located in even/odd placement sites wherein portions of the standard cells that carry signals within the metal layer do not connect to the via staples.