公开(公告)号：US20250149467A1

公开(公告)日：2025-05-08

申请号：US18917246

申请日：2024-10-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juil Choi ,  Jongho Park ,  Chanwook Park ,  Hyungjun Park ,  Taeoh Ha ,  Hongseo Heo

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor package includes a first die structure including a support substrate having a cavity, a first semiconductor chip in the cavity, and a first gap filling layer that fills a gap between an inner wall of the cavity and the first semiconductor chip; and a second die structure on the first die structure, the second die structure including a second semiconductor chip and a second gap filling layer surrounding an outer side surface of the second semiconductor chip. The first semiconductor chip includes a first backside insulating layer with second bonding pads. The second semiconductor chip includes a second front insulating layer with third bonding pads. The second bonding pads and the third bonding pads are directly bonded to each other.