公开(公告)号：US10078198B2

公开(公告)日：2018-09-18

申请号：US14822418

申请日：2015-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong-won Lee ,  Kwon-jeong Kang ,  Byung-ho Kim ,  Woo-seok Choi ,  Il-do Kim

IPC: H04N5/232 ,  G02B7/36 ,  G03B13/36

CPC classification number: G02B7/365 ,  G03B13/36 ,  H04N5/23212 ,  H04N5/23216 ,  H04N5/23293

Abstract: An imaging apparatus is provided, which includes an image sensor which includes a plurality of image pixels and a plurality of sensing pixels, and is configured to capture images through collection of light that is incident through a lens and the plurality of phase sensing pixels; and a processor configured to divide a region of interest of the image sensor into a plurality of sub-regions of interest, calculate disparity information of objects that correspond to the plurality of sub-regions of interest using at least one of the plurality of phase sensing pixels included in the plurality of sub-regions of interest, and determine a focal region in the region of interest on the basis of the disparity information. Accordingly, user convenience is increased.

公开(公告)号：US20190279904A1

公开(公告)日：2019-09-12

申请号：US16297950

申请日：2019-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byong-gook Jeong ,  Byung-ho Kim ,  Youn-jo Mun ,  Jeong-cheol An ,  Sung-il Cho ,  Dae-sang Chun ,  Man-hee Han

IPC: H01L21/78 ,  H01L21/02 ,  H01L21/268

Abstract: A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.

公开(公告)号：US10741448B2

公开(公告)日：2020-08-11

申请号：US16297950

申请日：2019-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byong-gook Jeong ,  Byung-ho Kim ,  Youn-jo Mun ,  Jeong-cheol An ,  Sung-il Cho ,  Dae-sang Chun ,  Man-hee Han

IPC: H01L21/78 ,  H01L21/02 ,  H01L21/268

Abstract: A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.

公开(公告)号：US10008398B2

公开(公告)日：2018-06-26

申请号：US15369138

申请日：2016-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-il Choi ,  Byung-ho Kim ,  Hong-seok Choi

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687 ,  B24B41/06 ,  B24B49/12 ,  B24B55/02 ,  B24B7/22

CPC classification number: H01L21/67092 ,  B24B7/228 ,  B24B41/068 ,  B24B49/12 ,  B24B55/02 ,  H01L21/67051 ,  H01L21/68714

Abstract: A substrate thinning apparatus includes a chuck table capable of supporting a substrate, a rotatable grinding device which includes a wheel tip capable of grinding the substrate supported by the chuck table, and a cleaning device configured to perform synchronized cleaning of the wheel tip while the grinding device is rotated. When the substrate thinning apparatus is used, even an extremely thin semiconductor device can be fabricated with substantial reliability.