公开(公告)号：US10269594B2

公开(公告)日：2019-04-23

申请号：US15203399

申请日：2016-07-06

申请人： Samsung Electronics Co., Ltd.

发明人： Nam Hoon Lee ,  Jungwoo Seo ,  Joonghan Shin ,  Byung Joo Oh ,  Jeongmin Lee ,  Gi-Nam Park ,  Jonghyun Lee

IPC分类号： H05B3/00 ,  F21V9/00 ,  G02B5/00 ,  G02B5/20 ,  C23C14/48 ,  H01L21/67 ,  H01L21/687

摘要： A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

公开(公告)号：US11764064B2

公开(公告)日：2023-09-19

申请号：US17479256

申请日：2021-09-20

申请人： Samsung Electronics Co., Ltd.

发明人： Nam Hoon Lee ,  Ill Hyun Park ,  Tae Hee Han ,  Jin Won Ma ,  Byung Joo Oh ,  Bong Ju Lee ,  Jae Hee Lee ,  Joo Yong Lee ,  Nam Ki Cho ,  Chang Seong Hong

IPC分类号： G01N21/25 ,  H01L21/268 ,  B23K26/354 ,  H01L21/67 ,  H01L21/66 ,  B23K26/03

CPC分类号： H01L21/268 ,  B23K26/032 ,  B23K26/354 ,  G01N21/25 ,  H01L21/67248 ,  H01L22/12

摘要： Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

公开(公告)号：US11158510B2

公开(公告)日：2021-10-26

申请号：US16393232

申请日：2019-04-24

申请人： Samsung Electronics Co., Ltd. ,  EO Technics Co., LTD

发明人： Nam Hoon Lee ,  Ill Hyun Park ,  Tae Hee Han ,  Jin Won Ma ,  Byung Joo Oh ,  Bong Ju Lee ,  Jae Hee Lee ,  Joo Yong Lee ,  Nam Ki Cho ,  Chang Seong Hong

IPC分类号： G01N21/25 ,  H01L21/268 ,  B23K26/354 ,  H01L21/67 ,  H01L21/66 ,  B23K26/03

摘要： Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

公开(公告)号：US20170076965A1

公开(公告)日：2017-03-16

申请号：US15203399

申请日：2016-07-06

申请人： Samsung Electronics Co., Ltd.

发明人： Nam Hoon Lee ,  Jungwoo Seo ,  Joonghan Shin ,  Byung Joo Oh ,  Jeongmin Lee ,  Gi-Nam Park ,  Jonghyun Lee

IPC分类号： H01L21/67 ,  H01L21/687 ,  G02B5/00 ,  H05B3/00 ,  C23C14/48 ,  G02B5/20

CPC分类号： H01L21/67115 ,  C23C14/48 ,  G02B5/003 ,  G02B5/205 ,  H01L21/68735 ,  H01L21/6875 ,  H01L21/68757 ,  H05B3/0047

摘要： A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

摘要翻译： 公开了一种透明板和包括该透明板的基板处理系统。 衬底处理系统可以包括腔室，设置在腔室下方的灯以及设置在腔室中以加载衬底的板。 该板可以包括具有第一透射率值的中心区域和具有比第一透射率值高的第二透射率值的边缘区域。