公开(公告)号：US09554024B2

公开(公告)日：2017-01-24

申请号：US14090302

申请日：2013-11-26

Applicant: Samsung Electronics Co., Ltd

Inventor： Dong-Hun Yi ,  Jong-Keun Jeon ,  Yong-Jin Lee ,  Kee-Seok Kim

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/2253 ,  H04N5/2257

Abstract: An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module.

Abstract translation: 图像传感器模块和成像装置。 图像传感器封装包括用于产生图像信号的多个图像传感器芯片和图像传感器芯片上的下部透明板。 上透明板位于下透明板上方，并且包括用于将外部光聚焦到图像传感器芯片的透镜。 在上透明板和下透明板之间插入粘合构件，因此上透明板和下透明板通过粘合构件彼此粘合，使得透镜和图像传感器芯片彼此对准。 除湿剂布置在粘合构件中以从图像传感器模块的内部吸收湿气。 因此，可防止湿气凝结在图像传感器模块的表面上。