SCAN DRIVING CIRCUIT AND DISPLAY DEVICE HAVING THE SAME

    公开(公告)号:US20240282248A1

    公开(公告)日:2024-08-22

    申请号:US18530609

    申请日:2023-12-06

    CPC classification number: G09G3/32 G09G3/3266 G09G2310/0267

    Abstract: A scan driving circuit includes multiple stages. A j-th stage of the stages includes a buffer part electrically connected to an output terminal that operates in response to a potential of a first control node, a holding part electrically connected to the output terminal that operates in response to a potential of a second control node, and an inverter part electrically connected to the first and second control nodes that controls the potentials of the first and second nodes. The inverter part includes a control transistor including a gate electrically connected to the first control node, and a drain electrically connected to a first voltage terminal that receives a first low voltage or a second voltage terminal that receives a second low voltage. The control transistor includes a dummy gate that receives a low voltage lower than or equal to the first and second low voltages.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20220181465A1

    公开(公告)日:2022-06-09

    申请号:US17652843

    申请日:2022-02-28

    Abstract: A semiconductor device includes a base substrate. A first thin-film transistor is disposed on the base substrate. The first thin-film transistor includes a first input electrode, a first output electrode, a first semiconductor pattern disposed below a first insulating layer, and a first control electrode disposed on the first insulating layer and below a second insulating layer. A second thin-film transistor includes a second input electrode, a second output electrode, a second semiconductor pattern disposed on the second insulating layer, and a second control electrode disposed on an insulating pattern formed on the second semiconductor pattern and exposes a portion of the second semiconductor pattern. The first semiconductor pattern includes a crystalline semiconductor. The second semiconductor pattern incudes an oxide semiconductor. The first semiconductor pattern, the first control electrode, the second semiconductor pattern, and the second control electrode are overlapped.

    GATE DRIVING CIRCUIT AND DISPLAY APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240257724A1

    公开(公告)日:2024-08-01

    申请号:US18513917

    申请日:2023-11-20

    Abstract: A gate driving circuit includes: a first pull-up control circuit, a pull-up circuit, a pull-down circuit and an inverting circuit. The first pull-up control circuit applies a previous carry signal which is one of carry signals of previous stages to a first control node in response to the previous carry signal. The pull-up circuit outputs a gate clock signal as a gate output signal in response to a signal of the first control node. The pull-down circuit outputs a second low voltage as the gate output signal in response to a first next carry signal which is one of carry signals of next stages. The inverting circuit outputs one of a first signal and a first low voltage to a third control node in response to the first signal and a signal of a second control node.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20200219991A1

    公开(公告)日:2020-07-09

    申请号:US16824339

    申请日:2020-03-19

    Abstract: A semiconductor device includes a base substrate. A first thin-film transistor is disposed on the base substrate. The first thin-film transistor includes a first input electrode, a first output electrode, a first semiconductor pattern disposed below a first insulating layer, and a first control electrode disposed on the first insulating layer and below a second insulating layer. A second thin-film transistor includes a second input electrode, a second output electrode, a second semiconductor pattern disposed on the second insulating layer, and a second control electrode disposed on an insulating pattern formed on the second semiconductor pattern and exposes a portion of the second semiconductor pattern. The first semiconductor pattern includes a crystalline semiconductor. The second semiconductor pattern includes an oxide semiconductor. The first semiconductor pattern, the first control electrode, the second semiconductor pattern, and the second control electrode are overlapped.

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