公开(公告)号：US09448356B2

公开(公告)日：2016-09-20

申请号：US14315103

申请日：2014-06-25

Applicant: Samsung Display Co., Ltd.

Inventor： Joo Woan Cho ,  Seok-Won Kang

IPC: F21V8/00 ,  H01L33/60 ,  H01L25/075

CPC classification number: G02B6/0073 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49113 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package and a display device having the same are disclosed. In one aspect, the display device includes a display panel and a backlight assembly including a light-emitting diode (LED) package configured to output light via an opening and a light guide plate configured to guide the emitted light to the display panel. The LED package includes a housing having a light reflecting property and including a bottom portion, a sidewall portion connected to the bottom portion, and a cover portion connected to the sidewall portion, wherein the opening is defined in the sidewall portion and faces the light guide plate. The LED package also includes a plurality of LEDs accommodated in the housing, and wherein the LEDs are arranged in a first direction extending from the light guide plate to the opening.

Abstract translation: 公开了一种发光二极管（LED）封装及其显示装置。 一方面，显示装置包括显示面板和背光组件，该背光组件包括被配置为经由开口输出光的发光二极管（LED）封装和被配置为将发射的光引导到显示面板的导光板。 LED封装包括具有光反射性的壳体，包括底部，连接到底部的侧壁部分和连接到侧壁部分的盖部分，其中开口限定在侧壁部分中并面向导光体 盘子。 LED封装还包括容纳在壳体中的多个LED，并且其中LED沿着从导光板延伸到开口的第一方向布置。

公开(公告)号：US09081226B2

公开(公告)日：2015-07-14

申请号：US13653231

申请日：2012-10-16

Applicant: Samsung Display Co., Ltd.

Inventor： Jung-Hyun Kim ,  Young-Min Park ,  Seok-Won Kang ,  Young-Hye Son

IPC: G02F1/1335 ,  H05K1/18 ,  H05K1/02

CPC classification number: G02F1/133603 ,  G02F1/133608 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10106

Abstract: A light-emitting module includes a printed circuit board (PCB) and a light emitting package. A hole is formed through the PCB. The light emitting package has a light source and a lead, and is disposed on the PCB. The light emitting package has a stepped portion having predetermined height. The stepped portion is disposed in the hole formed through the PCB. Thus, a thickness of the light-emitting module may be decreased, reliability of the light-emitting module may be enhanced, and thus a thickness and a bezel of a display apparatus may be decreased.

Abstract translation: 发光模块包括印刷电路板（PCB）和发光封装。 通过PCB形成一个孔。 发光封装具有光源和引线，并且设置在PCB上。 发光封装具有预定高度的阶梯部。 台阶部设置在通过PCB形成的孔中。 因此，可以降低发光模块的厚度，可以增强发光模块的可靠性，并且因此可以减小显示装置的厚度和边框。

公开(公告)号：US09316776B2

公开(公告)日：2016-04-19

申请号：US14066249

申请日：2013-10-29

Applicant: Samsung Display Co., Ltd.

Inventor： Seok-Won Kang ,  Sang-Chul Byun ,  Dong-Yeon Kang ,  Seok-Hyun Nam ,  Sang-Hyuk Lee ,  Hyoung-Joo Kim ,  Ji-Eun Nam ,  Ju-Young Yoon

IPC: H01L33/58 ,  F21V8/00 ,  H01L33/60 ,  G02F1/1335 ,  H01L33/48 ,  H01L33/50

CPC classification number: G02B6/0011 ,  G02B6/003 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02F1/133615 ,  H01L33/486 ,  H01L33/50 ,  H01L33/60

Abstract: A light source assembly includes a base substrate, a resin layer disposed on the base substrate, and exposing a portion of the base substrate, and a first light source disposed on the portion of the base substrate which is exposed by the resin layer. The first light source has a hexahedron shape. The first light source has a face in parallel with the base substrate and having a height smaller than length or width of the face.

Abstract translation: 光源组件包括基底基板，设置在基底基板上的树脂层，以及露出基底基板的一部分;以及第一光源，其设置在基板的由树脂层露出的部分上。 第一光源具有六面体形状。 第一光源具有与基底基板平行的面，其高度小于面的长度或宽度。