Abstract:
A carrier substrate removing apparatus configured to separate a flexible substrate bonded to a carrier substrate includes a carrier substrate holding unit configured to hold the carrier substrate separated from the flexible substrate; an inclined separation unit configured, with the carrier substrate holding unit, to separate the flexible substrate from the carrier substrate and to transport the flexible substrate at an angle; and a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate.
Abstract:
A carrier substrate removing apparatus configured to separate a flexible substrate bonded to a carrier substrate includes a carrier substrate holding unit configured to hold the carrier substrate separated from the flexible substrate; an inclined separation unit configured, with the carrier substrate holding unit, to separate the flexible substrate from the carrier substrate and to transport the flexible substrate at an angle; and a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate.