Abstract:
An organic light emitting diode display includes: a substrate; a first electrode on the substrate; a pixel definition layer having opening regions exposing the first electrode; a spacer on the pixel definition layer; a blocking layer between the pixel definition layer and the spacer, the blocking layer having a higher density than the pixel definition layer and the spacer; an organic emission layer on the first electrode in a region of the first electrode corresponding to the opening regions; and a second electrode on the organic emission layer.
Abstract:
An organic light-emitting display apparatus in which damages or defects are decreased when forming an emission layer, and a method of manufacturing the organic light-emitting display apparatus includes: a pixel electrode; an emission layer disposed on the pixel electrode and is capable of emitting light; a pixel defining layer that covers at least a portion of an edge of the emission layer such that a center portion of the emission layer is exposed; and an opposite electrode continuously formed over and across the pixel defining layer and the emission layer.
Abstract:
Provided are an organic light-emitting display device and a method of manufacturing the organic light-emitting display device, the method including operations of forming pattern layers in an active area and a pad area, respectively, on a substrate; and forming an encapsulation thin-film layer that covers the pattern layers on the substrate, wherein the operation of the encapsulation thin-film layer may include an operation of forming the encapsulation thin-film layer on the substrate by using a raw material of the encapsulation thin-film layer that is a single layer comprising an inorganic material.
Abstract:
A flexible display device manufacturing method includes preparing a substrate assembly in which a flexible substrate is formed on a carrier substrate; piling up a plurality of the prepared substrate assemblies in a heating furnace in multi-stages; performing heat treatment by providing hot blast onto each of the piled substrate assemblies in a horizontal direction; forming a display unit on the flexible substrate of the heat-treated substrate assembly; and separating the flexible substrate and the carrier substrate from each other. According to the above-described manufacturing method, since warpage of a flexible substrate after a carrier substrate and the flexible substrate are separated from each other may be suppressed, a subsequent process may be appropriately performed, productivity may be improved, and damage of products caused while the flexible substrate is handled may be reduced.
Abstract:
A flexible display device includes: a display substrate which is divided into a first region corresponding to a within-cell region of an integrated devices sheet from which the flexible display device is cut and into a second region corresponding to an outside-the-cell region of the integrated devices sheet, where within the first region there is provided a display unit including a light emitting element layer; a patterned inorganic film layer formed to be substantially continuously present within the first region of the display substrate and to be not present or not substantially continuously present within the second region of the display substrate; and a thin film encapsulation layer formed on the inorganic film layer to encapsulate the substantially continuously present portion of the inorganic film layer that is within the first region and the display unit, wherein an outer boundary of the thin film encapsulation layer is located more inwardly and toward an outer boundary of the display unit than is an outer boundary of the substantially continuously present portion of the inorganic film layer.
Abstract:
A flexible display device manufacturing method includes preparing a substrate assembly in which a flexible substrate is formed on a carrier substrate; piling up a plurality of the prepared substrate assemblies in a heating furnace in multi-stages; performing heat treatment by providing hot blast onto each of the piled substrate assemblies in a horizontal direction; forming a display unit on the flexible substrate of the heat-treated substrate assembly; and separating the flexible substrate and the carrier substrate from each other. According to the above-described manufacturing method, since warpage of a flexible substrate after a carrier substrate and the flexible substrate are separated from each other may be suppressed, a subsequent process may be appropriately performed, productivity may be improved, and damage of products caused while the flexible substrate is handled may be reduced.
Abstract:
Provided are an organic light-emitting display device and a method of manufacturing the organic light-emitting display device, the method including operations of forming pattern layers in an active area and a pad area, respectively, on a substrate; and forming an encapsulation thin-film layer that covers the pattern layers on the substrate, wherein the operation of the encapsulation thin-film layer may include an operation of forming the encapsulation thin-film layer on the substrate by using a raw material of the encapsulation thin-film layer that is a single layer comprising an inorganic material.