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    DISPLAY DEVICE
    1.
    发明申请
    DISPLAY DEVICE 有权

    公开(公告)号：US20220415869A1

    公开(公告)日：2022-12-29

    申请号：US17575099

    申请日：2022-01-13

    Applicant: Samsung Display Co., LTD.

    Inventor： Young Min PARK ,  Hyuk Hwan KIM

    IPC: H01L25/16 ,  H01L51/52

    Abstract: A display device includes a display element part disposed on a substrate, the display element part including a light emitting element, and an upper film layer disposed on the display element part, the upper film layer including an anti-electrostatic pattern. The anti-electrostatic pattern includes a conductive pattern and an anti-reflection pattern, and the conductive pattern and the anti-reflection pattern overlap each other.

    BACKLIGHT
    4.
    发明申请
    BACKLIGHT 有权

    公开(公告)号：US20210124110A1

    公开(公告)日：2021-04-29

    申请号：US17064651

    申请日：2020-10-07

    Applicant: Samsung Display Co., Ltd.

    Inventor： Young Min PARK ,  Hyuk Hwan KIM ,  Sun Hee OH ,  Kang Woo LEE

    IPC: F21V8/00

    Abstract: Provided herein may be a backlight including a light source board, light sources positioned on the light source board, an angular filter disposed on the light source board and the light sources, a first light guide layer configured to disposed between the light source board and the angular filter and to cover the light sources, and a second light guide layer disposed on the angular filter.

    LIGHT SOURCE MODULE AND BACKLIGHT UNIT INCLUDING THE SAME
    5.
    发明申请
    LIGHT SOURCE MODULE AND BACKLIGHT UNIT INCLUDING THE SAME 有权
    光源模块和背光单元，包括它们

    公开(公告)号：US20150369997A1

    公开(公告)日：2015-12-24

    申请号：US14509782

    申请日：2014-10-08

    Applicant: Samsung Display Co., Ltd.

    Inventor： Byoung Dae YE ,  Young Chun KIM ,  Hyuk Hwan KIM

    IPC: F21V8/00

    CPC classification number: G02B6/0073 ,  G02B6/0031 ,  G02B6/0078 ,  G02B6/0083 ,  G02B6/009 ,  H01L33/46 ,  H01L33/50 ,  H01L33/60

    Abstract: Provided are a light source module and a backlight unit. According to an embodiment, the light source module comprises a circuit board, at least one LED chip electrically connected onto the circuit board, a reflective surface on an upper surface of the LED chip configured to reflect light, and a fluorescent surface on at least one side surface of the LED chip configured to emit the light.

    Abstract translation: 提供了光源模块和背光单元。 根据实施例，光源模块包括电路板，电连接到电路板上的至少一个LED芯片，被配置为反射光的LED芯片的上表面上的反射表面，以及在至少一个 LED芯片的侧表面被配置为发射光。

    DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
    7.
    发明申请
    DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开

    公开(公告)号：US20190148661A1

    公开(公告)日：2019-05-16

    申请号：US16231852

    申请日：2018-12-24

    Applicant: Samsung Display Co., Ltd.

    Inventor： Sang Chul BYUN ,  Hyuk Hwan KIM ,  Seok Hyun NAM

    IPC: H01L51/50 ,  H01L51/56

    Abstract: A display device comprises: a light emitting array including a plurality of light emitting elements on a substrate and an insulating pattern disposed between the light emitting elements; a color conversion array including a plurality of sub-color conversion parts corresponding to the respective light emitting elements; and a printed circuit board having a first contact electrode connected to each of the light emitting elements, the printed circuit board driving the light emitting elements, wherein the plurality of sub-color conversion parts include first to third sub-color conversion parts that convert the light provided from corresponding light emitting elements into lights of first to third colors and emitting the converted lights, wherein each of the plurality of light emitting elements is electrically insulated from an adjacent light emitting elements.

    LIGHT SOURCE UNIT AND BACKLIGHT ASSEMBLY HAVING THE SAME
    10.
    发明申请
    LIGHT SOURCE UNIT AND BACKLIGHT ASSEMBLY HAVING THE SAME 有权
    光源单元和背光组件

    公开(公告)号：US20150138827A1

    公开(公告)日：2015-05-21

    申请号：US14262438

    申请日：2014-04-25

    Applicant: Samsung Display Co., Ltd.

    Inventor： Si Joon SONG ,  Hyuk Hwan KIM ,  Seok Hyun NAM ,  Byoung Dae YE ,  Young Keun LEE

    IPC: H01L23/60 ,  F21V8/00 ,  H01L25/16 ,  G02F1/1335 ,  H01L33/62 ,  H01L23/552

    CPC classification number: H01L25/167 ,  G02B6/0073 ,  G02B6/0083 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.

    Abstract translation: 提供了当LED芯片被容纳在发光二极管壳体封装（LED封装）中并且LED封装安装在印刷电路板上时，保护LED芯片免受ESD和EMI损坏的方法。 该方法包括在印刷电路板和LED封装的组合中不包括ESD和EMI抑制齐纳二极管的步骤，并且在印刷电路板和LED封装的组合内提供第一导电构件和间隔开的步骤 第二导电构件，其电连接到LED芯片，并且在它们之间限定至少一个绝缘ESD和/或EMI抑制区域，当经受大于预定阈值电压的绝对值的电压时，其绝缘性能分解。

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