公开(公告)号：US11721619B2

公开(公告)日：2023-08-08

申请号：US17023271

申请日：2020-09-16

Applicant: Samsung Display Co., Ltd.

Inventor： BoYeon Kim ,  Whee-Won Lee ,  Myeong Su Kim ,  Sang Hyun Lee

IPC: H01L23/498 ,  H01L23/00 ,  H10K59/131

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L24/16 ,  H10K59/131 ,  H01L2224/16225

Abstract: A flexible circuit film includes the following elements: a base film; a first power input terminal, a second power input terminal, a first power output terminal, and a second power output terminal each disposed on the base film; an integrated circuit chip disposed between the first power input terminal and the first power output terminal and overlapping the base film; first power wiring disposed on the base film, connecting the first power input terminal to the first power output terminal, and including a first connection part; and second power wiring disposed on the base film, connecting the second power input terminal to the second power output terminal, and including a second connection part. The first connection part and the second connection part are disposed between the base film and the integrated circuit chip, overlap the integrated circuit chip, and are spaced from each other.

公开(公告)号：US12113007B2

公开(公告)日：2024-10-08

申请号：US18230069

申请日：2023-08-03

Applicant: Samsung Display Co., Ltd.

Inventor： BoYeon Kim ,  Whee-Won Lee ,  Myeong Su Kim ,  Sang Hyun Lee

IPC: H01L23/498 ,  H01L23/00 ,  H10K59/131

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L24/16 ,  H10K59/131 ,  H01L2224/16225

Abstract: A flexible circuit film includes the following elements: a base film; a first power input terminal, a second power input terminal, a first power output terminal, and a second power output terminal each disposed on the base film; an integrated circuit chip disposed between the first power input terminal and the first power output terminal and overlapping the base film; first power wiring disposed on the base film, connecting the first power input terminal to the first power output terminal, and including a first connection part; and second power wiring disposed on the base film, connecting the second power input terminal to the second power output terminal, and including a second connection part. The first connection part and the second connection part are disposed between the base film and the integrated circuit chip, overlap the integrated circuit chip, and are spaced from each other.