ELECTRONIC DEVICE
    3.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240206095A1

    公开(公告)日:2024-06-20

    申请号:US18367536

    申请日:2023-09-13

    CPC classification number: H05K5/03

    Abstract: An electronic device includes a display module including a folding display unit which extends in a first direction and be foldable with reference to a folding axis and a first non-folding display unit and a second non-folding display unit which are spaced apart from each other with the folding display unit therebetween; a support member disposed below the display module, and including a folding part having a plurality of patterns defined therein and corresponding to the folding display unit and a first non-folding part and a second non-folding part respectively corresponding to the first non-folding display unit and the second non-folding display unit; and an adhesive layer disposed between the display module and the support member. The adhesive layer has a modulus of about 1 megapascal (MPa) to about 1500 MPa at −20 degrees Celsius) (° C.).

    WINDOW MOLDING APPARATUS AND WINDOW MOLDING METHOD USING THE SAME

    公开(公告)号:US20240317627A1

    公开(公告)日:2024-09-26

    申请号:US18733317

    申请日:2024-06-04

    CPC classification number: C03B23/0302 C03B23/0307

    Abstract: Provided is a window molding apparatus including an inner molding part including a core molding part, which includes a plurality of sub-bottom surfaces having different curvature radii, and a flat molding part spaced apart from the sub-bottom surfaces and disposed on the core molding part, and an outer molding part which is disposed below the inner molding part with a member to be processed therebetween and in which a groove corresponding to the core molding part is defined. The outer molding part includes a lower surface, an upper surface configured to face the lower surface, and a plurality of sub-groove surfaces having different curvature radii that define the groove to provide a window including sub-bent portions having different curvature radii.

Patent Agency Ranking