公开(公告)号：US20220302231A1

公开(公告)日：2022-09-22

申请号：US17696413

申请日：2022-03-16

Applicant: Samsung Display Co., LTD.

Inventor： Yong Duck SON ,  Ki-Hoon HA ,  Chan-Hyun PARK ,  Won Ho JANG ,  Myung Koo HUR

IPC: H01L27/32

Abstract: A display device includes a common voltage line disposed on a substrate, a passivation layer disposed on the common voltage line, a connection electrode disposed on the passivation layer and electrically connected to the common voltage line, a pixel definition layer disposed on the connection electrode and including a first opening, an emission layer disposed on the pixel definition layer, and a common electrode disposed on the emission layer and electrically connected to the connection electrode through the first opening, wherein the passivation layer includes a second opening surrounding the first opening.

公开(公告)号：US20230238494A1

公开(公告)日：2023-07-27

申请号：US17970406

申请日：2022-10-20

Applicant: Samsung Display Co., LTD.

Inventor： Nak Cho CHOI ,  Sang Woo AN ,  Yong Duck SON ,  Won Ho JANG ,  Myung Koo HUR

IPC: H01L33/62 ,  H01L25/075 ,  G09F9/302 ,  G09F9/33

CPC classification number: H01L33/62 ,  H01L25/0753 ,  G09F9/3026 ,  G09F9/33 ,  H01L2933/0066

Abstract: A display device includes a substrate including a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface, a plurality of subpixels on the first surface, a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate, and a circuit board on the second surface. The side wiring comprises a first portion on the first surface and a second portion on the first side surface, and includes metal particles where a packing density of the metal particles in the first portion is higher than a packing density of the metal particles in the second portion.

公开(公告)号：US20220189995A1

公开(公告)日：2022-06-16

申请号：US17461055

申请日：2021-08-30

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Hwan KIM ,  Yong Duck SON ,  Min-Sik JUNG ,  Jun Hwi PARK ,  Da Bin LEE ,  Won Ho JANG

IPC: H01L27/12

Abstract: A display device includes a metal layer disposed on a substrate; a transistor disposed on the metal layer; and a light emitting element electrically connected to the transistor, wherein the transistor includes a semiconductor layer at least partially overlapping the metal layer, the semiconductor layer includes a first region, a second region, and a channel region disposed between the first region and the second region, and the metal layer overlaps the second region and the channel region and is spaced apart from the first region in a plan view.

公开(公告)号：US20230326932A1

公开(公告)日：2023-10-12

申请号：US18184561

申请日：2023-03-15

Applicant: Samsung Display Co., LTD.

Inventor： Yong Duck SON ,  Won Bong BAEK ,  Sang Woo AN ,  Kye Uk LEE ,  Won Ho JANG ,  Nak Cho CHOI

IPC: H01L27/12 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L27/124 ,  H01L25/167 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05073 ,  H01L2224/05027 ,  H01L2224/05573 ,  H01L2224/05561 ,  H01L2224/05572 ,  H01L2224/05686 ,  H01L2224/06181 ,  H01L24/06 ,  H01L2224/08145 ,  H01L2224/13021 ,  H01L2224/16225 ,  H01L2924/0549 ,  H01L2924/12041

Abstract: A display device includes, a substrate including a first surface and a second surface opposite to the first surface; a light emitting element on the first surface of the substrate; a top surface pad on the first surface of the substrate and spaced from the light emitting element; a driving circuit on the second surface of the substrate to apply a driving signal for driving the light emitting element; a top surface connection line between the first surface of the substrate and the top surface pad to electrically connect the top surface pad to the light emitting element; an interlayer insulating layer between the top surface connection line and the top surface pad; and a side wiring on the top surface pad to connect the top surface pad to the driving circuit.

公开(公告)号：US20230238394A1

公开(公告)日：2023-07-27

申请号：US18158421

申请日：2023-01-23

Applicant: Samsung Display Co., LTD.

Inventor： Kye Uk LEE ,  Nak Cho CHOI ,  Sang Woo AN ,  Yong Duck SON ,  Won Ho JANG ,  Jung Hwan HWANG ,  Myung Koo HUR

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167 ,  H01L27/1218 ,  H01L24/05

Abstract: A display device includes a substrate including a first surface, a second surface opposite to the first surface, a first chamfered surface extending from one side of the first surface, a second chamfered surface extending from one side of the second surface, and a side surface connecting the first chamfered surface to the second chamfered surface, a pixel on the first surface of the substrate and including a light emitting element to emit light, a plurality of front pad parts on an edge of the first surface of the substrate and electrically connected to the pixel, a plurality of rear pad parts on an edge of the second surface of the substrate, and a plurality of side surface connection lines on the side surface of the substrate electrically connecting the plurality of front pad parts to the plurality of rear pad parts.

公开(公告)号：US20230237937A1

公开(公告)日：2023-07-27

申请号：US17890937

申请日：2022-08-18

Applicant: Samsung Display Co., LTD.

Inventor： Nak Cho CHOI ,  Sang Woo AN ,  Yong Duck SON ,  Won Ho JANG ,  Myung Koo HUR

IPC: G09F9/302 ,  H01L33/62 ,  H01L25/075 ,  H01L33/44 ,  H01L33/38

CPC classification number: G09F9/3026 ,  H01L33/62 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/382

Abstract: A display device includes: a substrate; a transistor layer on a first surface of the substrate; a pad portion; a first via layer on the transistor layer, and spaced from the pad portion; a second via layer on the first via layer, and exposing an upper surface of the first via layer; a third via layer on the second via layer, and exposing an upper surface of the second via layer; a display element layer on the third via layer; a lead line on a second surface of the substrate; a side surface connection line on the first surface, the second surface, and a side surface between the first surface and the second surface, the side surface connection line electrically connecting the pad portion to the lead line; and an over-coating layer covering the side surface connection line, and overlapping with the exposed upper surface of the first via layer.