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公开(公告)号:US20250025964A1
公开(公告)日:2025-01-23
申请号:US18906406
申请日:2024-10-04
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Sung Yong LEE , Toshinaru SUZUKI , Seung Ho MYOUNG , Gyeong Hee HAN , Gyoo Wan HAN
IPC: B23K26/38 , B23K26/12 , B23K26/70 , B23K101/40
Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.
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公开(公告)号:US20240274458A1
公开(公告)日:2024-08-15
申请号:US18644599
申请日:2024-04-24
Applicant: Samsung Display Co., LTD.
Inventor: Hee Sun JANG , Tae Hun KIM , Do Hwan KIM , Jae Han KIM , Seung Ho MYOUNG , Dae Young OH , Gyeong Hee HAN
IPC: H01L21/683 , H10K50/11 , H10K50/844 , H10K59/12 , H10K71/00
CPC classification number: H01L21/6833 , H10K71/00 , H10K50/11 , H10K50/844 , H10K59/12 , H10K59/1201
Abstract: The chuck for supporting a target substrate for a display device, the chuck includes: a base having a first surface to support an object and a second surface opposite the first surface, the first surface including a first area and a second area; and indentations formed in the second area and recessed from the first area in a thickness direction of the base. The indentations include a first indentation extending in a first direction and a second indentation extending in a second direction intersecting the first direction.
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公开(公告)号:US20230201969A1
公开(公告)日:2023-06-29
申请号:US18111940
申请日:2023-02-21
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Sung Yong LEE , Toshinaru SUZUKI , Seung Ho MYOUNG , Gyeong Hee HAN , Gyoo Wan HAN
IPC: B23K26/38 , B23K26/70 , B23K26/12 , B23K101/40
CPC classification number: B23K26/38 , B23K26/706 , B23K26/1224 , B23K26/127 , B23K2101/40
Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.
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公开(公告)号:US20220037186A1
公开(公告)日:2022-02-03
申请号:US17365990
申请日:2021-07-01
Applicant: Samsung Display Co., LTD
Inventor: Hee Sun JANG , Tae Hun KIM , Do Hwan KIM , Jae Han KIM , Seung Ho MYOUNG , Dae Young OH , Gyeong Hee HAN
IPC: H01L21/683 , H01L51/56
Abstract: The chuck for supporting a target substrate for a display device, the chuck includes: a base having a first surface to support an object and a second surface opposite the first surface, the first surface including a first area and a second area; and indentations formed in the second area and recessed from the first area in a thickness direction of the base. The indentations include a first indentation extending in a first direction and a second indentation extending in a second direction intersecting the first direction.
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公开(公告)号:US20240274456A1
公开(公告)日:2024-08-15
申请号:US18414773
申请日:2024-01-17
Applicant: Samsung Display Co., Ltd.
Inventor: Cheol Rae JO , Seung Ho MYOUNG , Yeong Min KIM , Yong U JEONG
IPC: H01L21/683 , H01L21/02 , H01L21/687
CPC classification number: H01L21/6833 , H01L21/02631 , H01L21/68742
Abstract: A substrate planarization device according to embodiments of the present disclosure may include a peripheral coupler including a first electrostatic chuck configured to be attached to a peripheral area of a substrate, and a first elevator configured to raise and lower the first electrostatic chuck in a vertical direction within a first movable range, and a central coupler including a second electrostatic chuck configured to be attached to a central area of the substrate, and a second elevator that is configured to raise and lower the second electrostatic chuck in the vertical direction within a second movable range that is greater than the first movable range. According to the substrate planarization device, a deposition system comprising the same, and a method of operating the substrate planarization device according to embodiments of the present disclosure, the substrate can be planarized.
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公开(公告)号:US20240242980A1
公开(公告)日:2024-07-18
申请号:US18390323
申请日:2023-12-20
Applicant: Samsung Display Co., LTD.
Inventor: Yonghyun KIM , Kyu-Bum KIM , Seung Ho MYOUNG , Yeongmin KIM , Ju Yeong YUN , Jungwoo CHOI
IPC: H01L21/67 , H01L21/677 , H01L21/687
CPC classification number: H01L21/67069 , H01L21/6719 , H01L21/67706 , H01L21/68764
Abstract: A substrate etching apparatus includes: a stage moving part for supporting a substrate carrier to which a substrate is attached in a vertical direction and for moving the substrate carrier to which the substrate is attached in a horizontal direction; a substrate carrier loading part positioned in a first region in the horizontal direction and for loading the substrate carrier to which the substrate is attached to the stage moving part; and an etching part positioned in a second region adjacent to the first region in the horizontal direction and for etching the substrate attached to the substrate carrier supported on the stage moving part in the vertical direction.
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公开(公告)号:US20210053159A1
公开(公告)日:2021-02-25
申请号:US16862815
申请日:2020-04-30
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Sung Yong LEE , Toshinaru SUZUKI , Seung Ho MYOUNG , Gyeong Hee HAN , Gyoo Wan HAN
Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.
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