公开(公告)号：US20240274456A1

公开(公告)日：2024-08-15

申请号：US18414773

申请日：2024-01-17

Applicant: Samsung Display Co., Ltd.

Inventor： Cheol Rae JO ,  Seung Ho MYOUNG ,  Yeong Min KIM ,  Yong U JEONG

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/02631 ,  H01L21/68742

Abstract: A substrate planarization device according to embodiments of the present disclosure may include a peripheral coupler including a first electrostatic chuck configured to be attached to a peripheral area of a substrate, and a first elevator configured to raise and lower the first electrostatic chuck in a vertical direction within a first movable range, and a central coupler including a second electrostatic chuck configured to be attached to a central area of the substrate, and a second elevator that is configured to raise and lower the second electrostatic chuck in the vertical direction within a second movable range that is greater than the first movable range. According to the substrate planarization device, a deposition system comprising the same, and a method of operating the substrate planarization device according to embodiments of the present disclosure, the substrate can be planarized.