Light-emitting diode package and method of manufacturing the same
    2.
    发明授权
    Light-emitting diode package and method of manufacturing the same 有权
    发光二极管封装及其制造方法

    公开(公告)号:US09447932B2

    公开(公告)日:2016-09-20

    申请号:US14306127

    申请日:2014-06-16

    CPC classification number: F21K9/90 H01L33/44 H01L33/502 H01L33/507 H01L33/644

    Abstract: A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.

    Abstract translation: 提供一种发光二极管(LED)封装及其制造方法。 LED封装包括封装模具,位于封装模具表面上的LED芯片和位于封装模具表面上并与LED芯片分离的波长转换器。 波长转换器包括位于封装模具表面上的第一阻挡层,位于第一阻挡层上的波长转换层和位于波长转换层上的第二阻挡层。

    Display device including connection pad contacting side surface of side terminal having resistance-reducing layer

    公开(公告)号:US11527603B2

    公开(公告)日:2022-12-13

    申请号:US17108354

    申请日:2020-12-01

    Abstract: A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210066435A1

    公开(公告)日:2021-03-04

    申请号:US16932831

    申请日:2020-07-20

    Abstract: A display device includes: a first layer including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, and a transfer wiring electrically connected to the side terminal and the pixel array; a second layer coupled with the first layer; a seal disposed between the first layer and the second layer and surrounding the pixel array; a filler, spaced apart from the seal, overlapping at least a portion of the side terminal and filling a space between the first layer and the second layer; and a conductive connection pad disposed on a side surface of the first layer and contacting the side terminal.

    Display device, apparatus for manufacturing display device and method for manufacturing display device

    公开(公告)号:US11409387B2

    公开(公告)日:2022-08-09

    申请号:US17403208

    申请日:2021-08-16

    Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

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