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公开(公告)号:US12132070B2
公开(公告)日:2024-10-29
申请号:US17557863
申请日:2021-12-21
Applicant: Samsung Display Co., LTD.
Inventor: Jin Taek Kim , Ki Nyeng Kang , Jun Ho Bae , Jong Hwan Cha , Min Cheol Chae , Su Min Choi
IPC: H01L33/38 , H01L27/15 , H01L33/08 , H01L33/62 , H10K59/121 , H10K59/122 , H10K59/123 , H10K59/124
CPC classification number: H01L27/156 , H01L33/08 , H01L33/382 , H01L33/62 , H10K59/1213 , H10K59/122 , H10K59/123 , H01L33/38 , H10K59/124
Abstract: A display device includes conductive layers on a substrate, a via layer on the conductive layers, a first electrode and a second electrode extending in one direction on the via layer and spaced from each other, a first insulating layer on the first electrode and the second electrode, a plurality of light emitting elements on the first insulating layer, each of the light emitting elements having one end on the first electrode and an other end on the second electrode, and a first connection electrode and a second connection electrode on the first insulating layer, the first connection electrode overlapping the first electrode, and the second connection electrode overlapping the second electrode, wherein the first connection electrode and the second connection electrode are in contact with the conductive layers through contact portions.
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公开(公告)号:US11327352B2
公开(公告)日:2022-05-10
申请号:US17150471
申请日:2021-01-15
Applicant: Samsung Display Co., LTD.
Inventor: Sang Myoung Lee , In Ho Park , Joo Lark Son , Min Cheol Chae
IPC: G02F1/1333 , H01L51/52 , G02F1/1345 , H01L27/32
Abstract: A display device includes a first substrate including a first side surface, a display area, and a pad area located outside of the display area and adjacent to the first side surface, a second substrate facing the first substrate and including a second side surface extending further outward than the first side surface of the first substrate, a printed circuit board electrically connected to the pad area of the first substrate and bent along the first side surface of the first substrate, and a light blocking chassis overlapping the printed circuit board and the first side surface of the first substrate.
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