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公开(公告)号:US20220367738A1
公开(公告)日:2022-11-17
申请号:US17836822
申请日:2022-06-09
IPC分类号: H01L31/0224 , H01L31/068
摘要: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
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公开(公告)号:US20190097077A1
公开(公告)日:2019-03-28
申请号:US16201943
申请日:2018-11-27
发明人: Richard Hamilton Sewell , Michel Arsène Olivier Ngamo Toko , Matthieu Moors , Jens Dirk Moschner
IPC分类号: H01L31/18 , H01L31/0224 , B32B37/06 , B32B38/00
摘要: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
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公开(公告)号:US10923616B2
公开(公告)日:2021-02-16
申请号:US16813258
申请日:2020-03-09
发明人: Richard Hamilton Sewell , Michel Arsène Olivier Ngamo Toko , Matthieu Moors , Jens Dirk Moschner
IPC分类号: H01L31/18 , H01L31/0224 , B32B37/06 , B32B38/00
摘要: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
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公开(公告)号:US09935213B2
公开(公告)日:2018-04-03
申请号:US14752818
申请日:2015-06-26
申请人: SUNPOWER CORPORATION
IPC分类号: H01L31/044 , H01L31/0224 , H01L31/068
CPC分类号: H01L31/022441 , H01L31/0682 , Y02E10/547
摘要: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
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公开(公告)号:US10177270B2
公开(公告)日:2019-01-08
申请号:US15717011
申请日:2017-09-27
申请人: SUNPOWER CORPORATION
发明人: Richard Hamilton Sewell , Michel Arsène Olivier Ngamo Toko , Matthieu Moors , Jens Dirk Moschner
IPC分类号: H01L31/18 , H01L31/0224 , B32B37/06 , B32B38/00
摘要: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
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公开(公告)号:US20180019364A1
公开(公告)日:2018-01-18
申请号:US15717011
申请日:2017-09-27
申请人: SUNPOWER CORPORATION
发明人: Richard Hamilton Sewell , Michel Arsène Olivier Ngamo Toko , Matthieu Moors , Jens Dirk Moschner
IPC分类号: H01L31/18 , H01L31/0224 , B32B37/06 , B32B38/00
CPC分类号: H01L31/18 , B32B37/06 , B32B38/004 , B32B2307/202 , B32B2307/40 , B32B2310/028 , B32B2310/0418 , B32B2311/12 , B32B2311/24 , B32B2457/12 , H01L31/022433 , H01L31/022441 , Y02E10/50
摘要: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
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公开(公告)号:US20200212248A1
公开(公告)日:2020-07-02
申请号:US16813258
申请日:2020-03-09
发明人: Richard Hamilton Sewell , Michel Arsène Olivier Ngamo Toko , Matthieu Moors , Jens Dirk Moschner
IPC分类号: H01L31/18 , H01L31/0224 , B32B37/06 , B32B38/00
摘要: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
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