WIRE-BASED METALLIZATION FOR SOLAR CELLS

    公开(公告)号:US20220367738A1

    公开(公告)日:2022-11-17

    申请号:US17836822

    申请日:2022-06-09

    IPC分类号: H01L31/0224 H01L31/068

    摘要: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.

    Wire-based metallization for solar cells

    公开(公告)号:US09935213B2

    公开(公告)日:2018-04-03

    申请号:US14752818

    申请日:2015-06-26

    摘要: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.